SiP Semiconductor Device Cooling via Interposer Passages
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing semiconductor devices in the form of 'system in a package' (SiP) face challenges in heat dissipation, particularly for devices positioned in mid-layers, which hinders extensive usage.
Innovation Solution
Incorporating a cooling device with passages for a cooling material, such as low-temperature gases or liquids, and connection electrodes between stacked devices on an interposer, allowing for efficient heat dissipation through the use of a cooling material supplier and protection layers formed via etching processes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If devices are stacked in mid-layers of SiP semiconductor device, then device integration and functionality are improved, but heat dissipation capability deteriorates
Solution Approach 1:
A cooling device is introduced as an intermediary component between the stacked devices and the external environment. This cooling device includes a passage through which cooling material flows, serving as a mediator to transfer heat from the mid-layer devices to the cooling material, thereby resolving the heat dissipation problem while maintaining device stacking integration
Solution Approach 2:
The invention utilizes fluid dynamics by introducing a cooling material (liquid or gas) that flows through the cooling device passage. The cooling material absorbs heat from the stacked devices through convection and conduction, effectively removing heat from the compact stacked structure without compromising the integrated design
2Temperature
If cooling device with passage is added to dissipate heat, then heat dissipation capability is improved, but device complexity increases
Solution Approach 1:
The cooling device is merged with the existing device structure by forming the passage through the device substrate itself. The connection electrodes that already exist for electrical connectivity are utilized to also serve as thermal conduction paths, combining thermal management functionality with the existing electrical interconnect structure
Solution Approach 2:
The passage structure in the cooling device serves multiple functions: it acts as a thermal conduction path for heat removal, provides structural support for the stacked devices, and can be integrated with the electrical connection layers. This multi-functionality reduces the need for separate dedicated cooling components, thereby limiting the increase in overall device complexity
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enables effective heat dissipation from SiP semiconductor devices, ensuring efficient transfer of heat to the exterior and maintaining device performance.
Implementation Method 1
a cooling device provided in at least one of the devices and including a passage for a cooling material
Implementation Method 2
passage for a cooling material... efficient transfer of heat to the exterior
Data Source
AI summary
A semiconductor device according to embodiments may include an interposer, a plurality of devices stacked on the interposer, a cooling device provided in at least one of the devices and including a passage for a cooling material, and a connection electrode provided between the devices, in which the connection electrode connects a signal electrode in an upper device to a signal electrode in a lower device.