System in Package Without PCB Using Copper Holder
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Solution Overview
Problem
Existing system in package (SiP) technologies face challenges in reducing manufacturing costs and scaling down volume/weight while maintaining reliability, as they often require complex printed circuit boards and are prone to failure if a single bare chip malfunctions.
Innovation Solution
A SiP structure without a printed circuit board, utilizing a copper holder with data and ground pins, silicon layers, and passive elements connected via metal wires, with an aluminum layer for improved grounding and thermal conductance, replacing traditional printed circuit boards for cost reduction and thickness minimization.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a printed circuit board is used in SiP structure, then electrical conduction and component mounting are achieved, but manufacturing cost increases and package thickness increases
Solution Approach 1:
The patent removes the printed circuit board from the SiP structure entirely, extracting only the essential function of electrical conduction. The copper holder with integrated data pins and ground pins replaces the PCB's electrical interconnection function, eliminating unnecessary structural complexity while maintaining electrical reliability.
Solution Approach 2:
The copper holder merges multiple functions into a single component: it serves as both the electrical conduction path (replacing PCB traces) and the mechanical support structure (replacing PCB substrate). The data pins and ground pins are integrated directly into the holder, combining electrical interconnection and structural support functions.
2Productivity
If multiple bare chips are enclosed in SiP, then integration density increases, but system reliability decreases due to single point of failure
Solution Approach 1:
The molding compound encapsulates all bare chips and interconnections in a protective barrier before they can fail. This protective layer cushions against environmental stressors and physical damage, preventing single point failures from propagating and protecting the integrated system's reliability while maintaining high integration density.
3Ease of manufacture
If traditional encapsulation structure is used, then manufacturing process is established, but manufacturing cost and package volume/weight cannot be reduced further
Solution Approach 1:
The printed circuit board is extracted from the package structure, removing unnecessary materials and reducing overall package volume and weight. The copper holder provides essential electrical functions with minimal material, achieving cost reduction and downsizing while maintaining manufacturing feasibility through simplified assembly processes.
4Reliability
If aluminum layer is added for grounding, then grounding effect and thermal conductance improve, but device complexity increases
Solution Approach 1:
The aluminum layer is merged with the existing copper holder structure, combining grounding and thermal management functions into the already-present structural component. This integration improves grounding effect and thermal conductance without adding separate complex layer structures, as the aluminum is applied directly to the holder's existing geometry.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution significantly reduces overall costs, eliminates the need for printed circuit boards, enhances electrical performance, and improves thermal management through direct metal wire conduction and aluminum grounding, thereby increasing reliability and efficiency.
Implementation Method 1
direct electric conduction through metal wires for promotion of electrical performance
Implementation Method 2
improves thermal management through direct metal wire conduction and aluminum grounding
Implementation Method 3
an aluminum layer structure for promotion of a grounding effect and good performance of thermal conductance
Data Source
AI summary
The present application describes a system in package which features no printed circuit board inside an encapsulation structure and comprises: a copper holder with a silicon layer at a top face; a plurality of dies mounted on the silicon layer and electrically connected to a plurality of data pins of the copper holder; a passive element mounted on the silicon layer and electrically connected to the dies wherein the dies are electrically connected to the ground pin of the copper holder; a molding compound encasing the dies and the passive element on the top face of the copper holder.