SiP-Embedded Core Layers for Scalable Information-Carrying Cards
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Solution Overview
Problem
Existing methods for manufacturing information carrying cards, such as smart cards, lack scalability and efficiency, and do not adequately protect sensitive electronic components, leading to durability issues and increased costs.
Innovation Solution
A core sheet and core layer comprising a substrate film with embedded antenna structures and system-in-package (SiP) connected via conductive materials, using a crosslinked polymer composition for thermal lamination, eliminating the need for circuit boards and allowing for mass production with enhanced flexibility and durability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If traditional injection molding or bonding methods are used to attach electronic components directly to the card body, then the card can be manufactured with integrated components, but the manufacturing process becomes complex and lacks large-scale manufacturing capability
Solution Approach 1:
The invention separates the electronic component assembly from the card body manufacturing. The core sheet with electronic components is prepared independently, then laminated onto the card body substrate. This segmentation allows each component to be optimized and manufactured separately, simplifying the overall process while enabling large-scale production.
Solution Approach 2:
The electronic components are embedded within a core sheet that is then laminated onto the card body. This nesting approach allows the complex electronic assembly to be contained within a protective layer, simplifying the external appearance and manufacturing process while maintaining component integrity.
2Adaptability or versatility
If electronic components are attached or mounted onto the card body through cavities, then the components can be integrated into the card structure, but the card body must be designed with specific cavities reducing manufacturing flexibility
Solution Approach 1:
The invention divides the card into two independent parts: the card body substrate and the core sheet with electronic components. This segmentation eliminates the need for cavities in the card body, allowing the card body to be manufactured as a simple, flexible substrate while the electronic components are integrated in the separate core sheet.
3Productivity
If existing manufacturing methods are used, then cards can be produced with integrated components, but productivity is low and costs are high
Solution Approach 1:
The core sheet with electronic components is prepared in advance as a complete assembly, then laminated onto the card body substrate. This preliminary preparation of the core sheet allows for efficient batch processing and reduces the time required during final assembly, significantly improving productivity and reducing manufacturing costs.
Solution Approach 2:
The invention combines multiple electronic components and their interconnections into a single core sheet assembly that is laminated onto the card body. This merging of components into a pre-assembled unit simplifies the manufacturing process, increases productivity, and reduces overall manufacturing costs compared to individual component attachment methods.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method enables high-quality, durable, and flexible information carrying cards with improved manufacturing efficiency, reducing costs and enhancing functionality by integrating multiple chips and components without complex packaging.
Implementation Method 1
During a thermal lamination process for making the core layer, the core sheet self-centered in a cross-linkable polymer composition before the crosslinkable polymer composition is cured to become the crosslinked polymer composition
Data Source
AI summary
The present disclosure provides a core sheet, a core layer comprising the core sheet for an information carrying card, an information carrying card comprising the same, and the methods of making the core sheet, the core layer, and the information carrying card. The core layer comprises a core sheet, which includes a substrate film and a plurality of component sections, Each component section comprises an antenna structure disposed on or embedded within the substrate film, and a system-in-package comprising at least one chip. The system-in-package is disposed on or embedded within the substrate film and electrically connected with the antenna structure. The antenna structure is made of a conductive material. The core layer further includes a crosslinked polymer composition disposed on both side of the substrate film. The substrate film may be centered in the crosslinked composition in a direction normal to a plane of the core layer.