SiP Module Double Plastic-Sealing for Electromagnetic Shielding
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Solution Overview
Problem
The current manufacturing process of system in package (SiP) modules is complicated due to the difficulty in controlling the binding force when implementing electromagnetic shielding by sputtering a metal layer, which requires additional steps and increases the complexity of the process.
Innovation Solution
A method of double plastic-sealing is introduced, where electronic units are welded onto a PCB, followed by a first-time filling of plastic materials, pasting a functional film, and a second-time filling to cover the film and periphery, simplifying the process and eliminating the need for subsequent metal sputtering for electromagnetic shielding.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If electromagnetic shielding is implemented by sputtering a metal layer after plastic sealing, then electromagnetic protection is achieved, but the manufacturing process becomes complicated and binding force control becomes difficult
Solution Approach 1:
The patent combines electromagnetic shielding function with the plastic sealing layer by incorporating conductive materials (such as silver powder, copper powder, or conductive polymers) directly into the plastic molding compound. This merging of functions eliminates the need for separate metal sputtering processes and subsidiary films, thereby achieving electromagnetic protection while simplifying the manufacturing process to a single integrated plastic sealing step.
Solution Approach 2:
The patent uses composite materials by formulating the plastic sealing layer with conductive fillers (metal powders like silver or copper, or conductive polymers) to create a material that simultaneously provides both structural sealing and electromagnetic shielding properties. This composite approach replaces the traditional multi-layer structure with a single composite material solution that achieves both protection and simplification.
2Reliability
If electromagnetic shielding is implemented by sputtering a metal layer, then electromagnetic protection is achieved, but additional steps are required increasing process complexity
Solution Approach 1:
The patent merges electromagnetic shielding with the plastic sealing process by integrating conductive materials into the molding compound. This allows the electromagnetic shielding function to be achieved during the same manufacturing step as plastic sealing, eliminating additional sputtering steps and subsidiary film attachment processes, thereby improving ease of manufacture while maintaining electromagnetic protection.
Solution Approach 2:
The plastic sealing layer is designed to serve multiple functions simultaneously: providing structural sealing protection and providing electromagnetic shielding. By making the sealing layer multi-functional, the patent eliminates the need for separate specialized layers or processes, thereby simplifying the manufacturing process while achieving comprehensive protection.
3Reliability
If subsidiary films or materials are attached for electromagnetic shielding, then electromagnetic protection is achieved, but the manufacturing process becomes more complicated
Solution Approach 1:
The patent eliminates the need for separate subsidiary films by integrating electromagnetic shielding materials directly into the plastic sealing layer. This merging of functions reduces the total number of process steps from multiple sequential operations (plastic sealing, then attaching shielding films) to a single integrated plastic molding operation, thereby reducing device complexity while maintaining electromagnetic protection.
Data Source
AI summary
A manufacturing method of a system in package (SiP) module based on double plastic-sealing, including: welding electronic units required by the SiP module onto a top surface of a Printed Circuit Board (PCB), with welding spots being reserved on a bottom surface of the PCB to obtain a PCB assembly (PCBA); implementing a first-time filling to fill on plastic materials on a top surface of the PCBA, ensuring that the plastic materials cover the electronic units, and obtaining a first-time plastic-sealing PCBA after the plastic materials are solidified; pasting tightly a functional film on a top surface of the first-time plastic-sealing PCBA to obtain a film-pasted PCBA; and implementing a second-time filling to fill on plastic materials on the film-pasted PCBA, ensuring that the plastic materials cover a top surface and a periphery of the film-pasted PCBA, and obtaining the SiP module after the plastic materials are solidified.