External Debug Connectors for System-in-Package Power Management
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
In System-In-Package (SiP) systems, the signals from power management devices and microprocessors are not accessible externally, making it difficult to debug, manage, or test individual components after the system is packaged, as all connections are encapsulated inside the package.
Innovation Solution
A SiP device with external connectors that allow selected signals to be connected both internally for normal operation and externally for programming, testing, and debugging, including a Power Management Integrated Circuit (PMIC) with a programmable power generating subsystem and control logic subsystem, enabling external configuration and monitoring of power management and microprocessor interactions.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of moving object
If all connections are encapsulated inside the package for normal SiP operation, then system integration is improved, but accessibility for debugging and testing deteriorates
Solution Approach 1:
The patent segments the connection interfaces by providing separate connector types: internal connectors for normal operation and external connectors for debugging access. This segmentation allows the system to maintain integration benefits while providing dedicated access paths for testing and debugging operations without interfering with normal packaged operation.
Solution Approach 2:
The patent introduces external connectors as intermediary interfaces that mediate between the encapsulated internal components and the external debugging equipment. These connectors serve as access points that allow debugging signals to reach internal components without requiring physical disassembly of the package, thus maintaining system integration while enabling debuggability.
2Ease of operation
If signals are made externally accessible for debugging, then debuggability is improved, but system complexity increases
Solution Approach 1:
The patent implements universal external connectors that can handle multiple types of signals (power, ground, data, control) through a single standardized interface. This multi-functionality reduces the number of different connector types needed, thereby managing system complexity while providing comprehensive debugging access to all signal types.
Solution Approach 2:
The patent incorporates debugging connectors and signal routing into the package design from the beginning, during the manufacturing process. This preliminary action ensures that debugging access is built-in and requires no additional external wiring or modifications, thereby limiting the increase in system complexity while maximizing debuggability.
3Adaptability or versatility
If power management device is configured after packaging, then adaptability is improved, but risk of damaging components increases
Solution Approach 1:
The patent implements feedback mechanisms where the external debugging interface allows real-time monitoring of power management device status and output voltages. This feedback enables operators to verify device state before making configuration changes, and to detect potential damage conditions immediately, thereby allowing flexible post-packaging configuration while minimizing the risk of component damage through controlled, monitored access.
Data Source
AI summary
A power management device and microprocessor within a System-in-Package (SiP) are provided with communication signals externally available as outputs from the SiP so that they can be configured by an external device. Methods for the configuration of SiPs and Power Management Integrated Circuits (PMICs) packaged within a SiP are also provided.