System-in-Package Flash Memory Card Space Reduction
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Solution Overview
Problem
Conventional flash memory cards occupy most of the available space due to individually packaged integrated circuit components on printed circuit boards, limiting their compactness and efficiency.
Innovation Solution
A system-in-a-package approach where multiple integrated circuit components are packaged together in a single package, cut to fit within the shape of a flash memory card lid, reducing space usage and incorporating features like chamfers and notches for compatibility with existing card formats.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If individually packaged IC components are mounted on a printed circuit board, then complete electronic system functionality is achieved, but the printed circuit board occupies all or almost all of the available space within the card
Solution Approach 1:
The patent merges multiple individually packaged IC components (logic circuits, memory, I/O circuits) into a single integrated circuit package. This consolidation eliminates the need for a large printed circuit board, reducing the space occupied from nearly the entire card area to a significantly smaller footprint while maintaining all required electronic system functionalities.
Solution Approach 2:
The patent implements a nested structure where multiple functional IC components are housed within a single integrated circuit package. This nested arrangement allows the complete electronic system to be contained in one compact unit, which then occupies minimal space within the flash memory card structure.
2Adaptability or versatility
If a printed circuit board is formed to contain all individually packaged components, then complete electronic system is achieved, but the card design is limited in compactness
Solution Approach 1:
By combining all electronic components into one integrated package, the patent eliminates the need for a large printed circuit board that dictated the card's dimensions. This merging enables a more compact card design with reduced length and width while preserving complete electronic system functionality.
3Reliability
If IC components are packaged separately and mounted on a substrate, then individual component functionality is maintained, but the overall package size increases
Solution Approach 1:
The patent merges multiple separately packaged IC components into a single integrated circuit package, significantly reducing the overall volume. Each component's functionality is preserved within the integrated package, achieving both compact volume and maintained reliability.
Data Source
AI summary
A system-in-a-package based flash memory card including an integrated circuit package occupying a small overall area within the card and cut to conform to the shape of a lid for the card. An integrated circuit may be cut from a panel into a shape that fits within and conforms to the shape of lids for a finished memory card, such as for example an SD Card. The integrated circuit package may be a system-in-a-package, a multi-chip module, or other arrangement where a complete electronic system is formed in a single package.