SIP Module Circuit Pattern Embedding in Encapsulant
Solution Overview
Problem
Semiconductor devices face challenges in achieving a uniform thickness of circuit patterns, which can lead to interconnect cracking and increased package height, contradicting design goals of reduced footprint and increased functionality.
Innovation Solution
The method involves embedding a circuit pattern within the encapsulant of a system-in-package (SIP) module, using precision laser cutting and planarization to maintain a constant thickness, thereby reducing the overall height of the semiconductor package while ensuring mechanical and electrical connectivity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a bottom interconnect substrate with circuit pattern is used to provide mechanical and electrical connectivity, then electrical interconnect is supported, but the overall package height increases
Solution Approach 1:
The patent merges the circuit pattern directly into the encapsulant material, combining the structural support function and electrical interconnect function into a single integrated component, eliminating the need for a separate bottom interconnect substrate and thereby reducing package height
Solution Approach 2:
The encapsulant is given multiple functions: it provides mechanical protection, structural support, and electrical interconnect through the embedded circuit pattern, replacing the need for dedicated interconnect substrate layers and reducing overall package complexity and height
2Reliability
If circuit pattern thickness is increased to ensure connectivity, then electrical interconnect reliability improves, but interconnect cracking occurs due to irregular thickness
Solution Approach 1:
The patent replaces traditional mechanical lamination processes with laser cutting and planarization processes, enabling precise control of circuit pattern thickness and eliminating thickness irregularities that cause interconnect cracking
Solution Approach 2:
The patent changes the thickness parameter of the circuit pattern from irregular (causing cracking) to uniform and controlled (preventing cracking), achieving both reliable electrical interconnect and structural integrity
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach allows for a more compact and reliable semiconductor package with a constant circuit pattern thickness, reducing assembly issues and enhancing design flexibility, while minimizing the height of the SIP module.
Implementation Method 1
precision laser cutting
Data Source
AI summary
An SIP module includes a plurality of electrical components mounted to an interconnect substrate. The electrical components and interconnect substrate are covered by an encapsulant. A conductive post is formed through the encapsulant. A plurality of openings is formed in the encapsulant by laser in a form of a circuit pattern. A conductive material is deposited over a surface of the encapsulant and into the openings to form an electrical circuit pattern. A portion of the conductive material is removed by a grinder to expose the electrical circuit pattern. The grinding operation planarizes the surface of the encapsulant and the electrical circuit pattern. The electrical circuit pattern can be a trace, contact pad, RDL, or other interconnect structure. The electrical circuit pattern can also be a shielding layer or antenna. An electrical component is disposed over the SIP module and electrical circuit pattern.