SiP Phased-Array Antenna With Through-Mold Trenches
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
The miniaturization of semiconductor devices poses challenges in locating radio-frequency antennas close to active devices while maintaining low RF loss and noise shielding, which existing technologies have not adequately addressed.
Innovation Solution
The solution involves a semiconductor device package design that includes a phased-array antenna module with a redistribution layer and a through-mold trench to minimize RF loss and electromagnetic interference, where the RFIC die is coupled indirectly to the redistribution layer and isolated within a through-mold trench, and the processor die is directly coupled to the redistribution layer, with vertical-line interconnects shielded by a grounded voltage source.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If semiconductor devices are miniaturized to reduce size, then device dimensions are reduced, but it becomes difficult to locate radio-frequency antennas close to active devices while maintaining low RF loss and noise shielding
Solution Approach 1:
The patent transitions from planar antenna layouts to three-dimensional vertical interconnect structures. Through-mold trenches extend vertically through the package substrate, allowing RFIC dies to be positioned in multiple layers above the processor die. This vertical dimension enables close coupling between antennas and active devices while maintaining electrical isolation and low RF loss through direct vertical interconnects rather than lateral traces.
Solution Approach 2:
The patent implements nested structures where RFIC dies are positioned within vertical columns defined by through-mold trenches, which are themselves nested within the overall package substrate structure. The grounded voltage source structures are nested around the vertical interconnects, creating concentric shielding layers. This nesting allows multiple functional elements to occupy overlapping spatial volumes, achieving close coupling without lateral expansion.
2Reliability
If antennas are placed close to active devices to reduce RF loss, then signal integrity improves, but electromagnetic interference and noise shielding become more challenging
Solution Approach 1:
The patent introduces grounded voltage source structures as intermediary elements between the RFIC dies and surrounding environment. These grounded structures act as shielding intermediaries that intercept electromagnetic interference before it can affect the RF signals. The vertical interconnects are positioned between the antennas and potential sources of interference, mediating the electromagnetic environment while maintaining signal integrity.
Solution Approach 2:
The patent applies different structural qualities to different regions: the through-mold trenches provide localized vertical channels for RF signals, while the grounded voltage source structures provide localized electromagnetic shielding. The processor die region has different shielding requirements than the RFIC die regions, and each area is configured with appropriate local structures. This localized quality optimization allows close antenna placement without compromising overall EMI performance.
3Quantity of substance
If a compact form factor is achieved through miniaturization, then device density increases, but the complexity of assembling and aligning multiple components increases
Solution Approach 1:
The through-mold trenches are formed and prepared in advance during package substrate fabrication, creating pre-defined vertical pathways for interconnects. The grounded voltage source structures are pre-positioned within these trenches before RFIC dies are attached. This preliminary preparation of the substrate structure simplifies subsequent assembly steps, as components can be directly positioned onto pre-configured interconnect structures rather than requiring complex alignment procedures.
Solution Approach 2:
The patent divides the package into segmented vertical columns, each defined by a through-mold trench and containing specific RFIC dies and interconnect structures. This segmentation allows independent fabrication and testing of individual column modules, which can then be assembled into the complete device. The modular column structure reduces overall assembly complexity by breaking down the complex multi-component system into manageable, repeatable units.
Data Source
AI summary
A system-in-package includes a package substrate that at least partially surrounds an embedded radio-frequency integrated circuit chip and a processor chip mated to a redistribution layer. A wide-band phased-array antenna module is mated to the package substrate with direct interconnects from the radio-frequency integrated circuit chip to antenna patches within the antenna module. Additionally, fan-out antenna pads are also coupled to the radio-frequency integrated circuit chip.