3D SiP POP Structure Reducing Package Thickness and Area

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Solution Overview

Problem

Conventional packaging techniques, such as leadframe-based three-dimensional packages, struggle to accommodate increasing circuit density due to limitations in package thickness, footprint area, and insufficient input/output leads, leading to mechanical instability and inefficiencies in heat dissipation and protection.

Innovation Solution

A three-dimensional System-In-Package (SiP) Package-On-Package (POP) structure is developed, featuring a support element around electronic devices with a filling material and dielectric layers, signal channels, and conductive elements, which reduces package thickness and area while enhancing board-level reliability through improved thermal management and mechanical stability.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Device complexity

If conventional leadframe-based three-dimensional packaging is used, then package structure is simple, but package thickness and footprint area are large, and input/output leads are insufficient

Engineering Contradiction:

Improvepackage structureVSAvoidpackage thickness

Core Design Contradiction:

Device complexityVSLength of stationary object

Solution Approach 1:

The patent transitions from conventional two-dimensional leadframe packaging to a three-dimensional SiP POP structure by stacking multiple electronic devices vertically. This dimensional change allows the package to accommodate higher circuit density without increasing footprint area, while the support element and signal channels enable mechanical stability and electrical connectivity in the vertical dimension.

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

Solution Approach 2:

The patent embeds electronic devices within a support element structure, where the support element surrounds and protects the devices. This nesting approach allows the package to achieve compact thickness by integrating multiple functions (structural support, electrical connection, and device housing) into a nested configuration rather than using separate external components.

Inventive Principle:

Principle #7Nested doll (Nesting)

2Device complexity

If conventional leadframe-based three-dimensional packaging is used, then package structure is simple, but footprint area is large

Engineering Contradiction:

Improvepackage structureVSAvoidfootprint area

Core Design Contradiction:

Device complexityVSArea of stationary object

Solution Approach 1:

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

3Productivity

If Wafer level package technique is used, then manufacturing time and cost are reduced, but CTE difference between materials causes mechanical instability

Engineering Contradiction:

Improvemanufacturing timeVSAvoidmechanical stability

Core Design Contradiction:

ProductivityVSStability of the object's composition

Solution Approach 1:

The patent introduces a support element as an intermediary structure between the electronic devices and the external environment. This support element acts as a mechanical buffer that compensates for CTE differences between materials, providing structural stability while allowing the WLP manufacturing process to be used. The support element absorbs thermal stress and prevents mechanical failure during temperature cycling.

Inventive Principle:

Principle #24Intermediary (Mediator)

4Reliability

If stacked redistribution layers are formed over the built-up layer, then electrical connections are achieved, but package thickness is increased

Engineering Contradiction:

Improveelectrical connectionsVSAvoidpackage thickness

Core Design Contradiction:

ReliabilityVSLength of stationary object

Solution Approach 1:

The patent segments the electrical connection function into two parts: signal channels formed in the support element and conductive elements on the device. This segmentation allows the signal channels to provide mechanical support while establishing electrical connections, eliminating the need for multiple stacked redistribution layers and reducing package thickness.

Inventive Principle:

Principle #1Segmentation

5Ease of manufacture

If conventional packaging techniques are used, then manufacturing process is simple, but heat dissipation is insufficient

Engineering Contradiction:

Improvemanufacturing processVSAvoidheat dissipation

Core Design Contradiction:

Ease of manufactureVSTemperature

Solution Approach 1:

The patent gives the support element multiple functions: structural support, electrical connection through signal channels, and heat dissipation. By making the support element universal, the package achieves improved heat dissipation without adding separate thermal management components, maintaining manufacturing simplicity while solving the heat dissipation problem.

Inventive Principle:

Principle #6Universality (Multi-functionality)

Data Source

PatentUS8619431B2Three-dimensional system-in-package package-on-package structure

Publication Date: 2013.12.31 TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD

AI summary

The present invention provides a three-dimensional System-In-Package (SIP) Package-On-Package (POP) structure comprising a support element formed around a first electronic device. A filling material is filled between the first electronic device and the support element. Signal channels are coupled to first die pads of the first electronic device. Conductive elements form signal connection between the first end of the signal channels and the second die pads of a second electronic device.