SiP Service Module Segmentation for Reduced Development Complexity
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Solution Overview
Problem
Current systems require custom design for each implementation, leading to increased development time, resource consumption, and risk due to the need for discrete components for support functions like memories, power supplies, and wireless modules, which are not efficiently integrated.
Innovation Solution
A System in a Package (SIP) service module that integrates essential 'service components' such as memories, power management, and communications, allowing for a standardized base that can be combined with processors and programmable logic devices to streamline system design and reduce development complexity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If custom design is used for each implementation with discrete components, then system functionality can be achieved, but development time and complexity increase
Solution Approach 1:
The system is divided into a standardized service module containing common support functions (memories, power supplies, wireless modules) and a custom processing module. This segmentation allows the service module to be reused across different implementations while only the processing module needs customization, thereby reducing development complexity without sacrificing functionality.
Solution Approach 2:
The service module is designed as a universal platform that can serve multiple different processing modules and system configurations. By integrating common service functions into a single standardized module, it can be reused across various implementations, reducing both development time and complexity while maintaining full system functionality.
2Adaptability or versatility
If discrete components are used for support functions, then system customization is possible, but integration efficiency decreases
Solution Approach 1:
Multiple discrete support function components (memories, power supplies, wireless modules) are merged into a single integrated service module. This consolidation maintains the ability to customize the processing module while dramatically improving integration efficiency, as the service module comes pre-assembled and requires minimal integration effort.
3Loss of time
If standardized service module is used, then development time is reduced, but system specificity may be limited
Solution Approach 1:
The system is segmented into a standardized service module and a customizable processing module. This segmentation enables rapid deployment using the proven service module while maintaining full system specificity through customization of the processing module, thereby reducing development time without limiting adaptability.
Data Source
AI summary
The present disclosure describes a service module for a System in a Package (SiP) device. This includes methods of manufacture, use, and testing relating to the same.


