SiP Shielding Structure With Integrated Coils and Antennas
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Solution Overview
Problem
Electronic devices with discrete components for wireless charging, antennas, and other features face challenges in compact design due to increased space consumption and manufacturing complexity, leading to larger device footprints and reduced durability.
Innovation Solution
Systems-in-packages (SiPs) with integrated electromagnetic shielding layers and patterned structures, such as wireless charging coils and antennas, are used to reduce the need for separate components, allowing for compact designs and improved durability by integrating these features directly onto shielding layers without compromising performance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If discrete components (wireless charging coils, antennas) are used, then functionality is achieved, but device footprint increases
Solution Approach 1:
The patent combines multiple discrete components (wireless charging coils, antennas, electromagnetic shielding layers) into a single integrated system-in-package structure. The shielding layer serves dual purposes as both EMI protection and as the substrate for mounting wireless charging and antenna components, thereby reducing overall device footprint while maintaining all required functionalities.
Solution Approach 2:
The electromagnetic shielding layer is designed to perform multiple functions simultaneously: it provides electromagnetic interference shielding, serves as a mounting substrate for wireless charging coils and antennas, and acts as a structural component of the package. This multi-functionality eliminates the need for separate discrete components, reducing device footprint.
2Adaptability or versatility
If discrete components are used, then functionality is achieved, but manufacturing complexity increases
Solution Approach 1:
The patent integrates multiple components into a single package during the semiconductor packaging process. The system-in-package structure allows wireless charging coils, antennas, and shielding layers to be manufactured and assembled together as one unit, reducing the number of separate manufacturing steps and assembly operations required compared to using discrete components.
3Adaptability or versatility
If discrete components are used, then functionality is achieved, but device durability decreases
Solution Approach 1:
The system-in-package structure encloses all components (wireless charging coils, antennas, shielding layers) within a single protected package with standardized interfaces. This integration reduces the number of external connections and exposed components, thereby improving device durability and reliability.
4Area of stationary object
If multiple shielding components are integrated, then device footprint is reduced, but manufacturing complexity increases
Solution Approach 1:
The patent performs preliminary integration of multiple shielding components and functional elements during the semiconductor packaging manufacturing process. The system-in-package structure is fabricated as a complete integrated unit before being installed in the final device, thereby reducing device footprint while managing manufacturing complexity through standardized packaging processes.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach reduces device footprint, simplifies manufacturing, and enhances durability by eliminating the need for separate components, while maintaining or improving performance and functionality.
Implementation Method 1
a first electromagnetic interference shielding component disposed around an outer surface of the molding compound, wherein the first electromagnetic interference shielding component has a multi-layer structure, and a second electromagnetic interference shielding component that at least partially forms an outer surface of the system-in-package
Data Source
AI summary
Systems and methods are disclosed for systems-in-packages that have multiple shielding components. In one embodiment, a system-in-package may include a substrate, an integrated circuit package disposed on the substrate, a system-on-a-chip disposed on the substrate, and a molding compound disposed over the integrated circuit package and the system-on-a-chip. The system-in-package may include a first electromagnetic interference shielding component disposed about the molding compound, and a second electromagnetic interference shielding component that at least partially forms an outer surface of the system-in-package. The second electromagnetic interference shielding component may have a patterned structure formed thereon.