SIP Package Shielding Layout for Integrated Conformal and Compartment EMI
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Solution Overview
Problem
Traditional SIP packaging requires separate processes for conformal and compartment shielding, leading to increased resistance due to viscosity issues with conductive silver paste and generation of burrs during metal overlay application.
Innovation Solution
A shielding process for SIP packaging that simultaneously forms conformal and compartment shielding by cutting a covering layer to create half-cut trenches and grooves, followed by a metal overlay application that contacts an earth wire for conduction, allowing for continuous and large-scale manufacturing without burrs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conductive silver paste is filled into the groove separately for compartment shielding, then compartment shielding is achieved, but holes occur due to high viscosity leading to increased resistance
Solution Approach 1:
The patent combines conformal shielding and compartment shielding into a single integrated process. The metal overlay is applied simultaneously to form both the conformal shielding layer on external surfaces and the compartment shielding in grooves, eliminating the need for separate filling operations and avoiding holes caused by high viscosity paste
2Reliability
If conformal shielding and compartment shielding are performed separately, then each shielding type can be optimized, but manufacturing complexity and time increase
Solution Approach 1:
The patent merges conformal shielding and compartment shielding into a single manufacturing step. By applying metal overlay material simultaneously to form both shielding types, the process reduces manufacturing time and complexity while maintaining the shielding effectiveness of both methods
Solution Approach 2:
The patent performs preliminary preparation by forming grooves and positioning metal overlay material before final application. This preliminary structuring allows the metal overlay to be applied in a single step that simultaneously creates both conformal and compartment shielding, improving manufacturing efficiency
3Reliability
If metal overlay is applied to single surface separately, then conformal shielding is formed, but burrs occur during the process
Solution Approach 1:
The patent combines conformal shielding application with compartment shielding formation in a single metal overlay step. This integrated approach eliminates the separate surface application process that generates burrs, as the metal overlay is deposited simultaneously in grooves and on external surfaces under controlled conditions
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This process enhances manufacturing efficiency, reduces production costs, and eliminates burrs by integrating conformal and compartment shielding in a single procedure using the same material, improving the overall shielding effectiveness.
Implementation Method 1
the metal overlay is formed by electroplating, dispensing or spraying
Implementation Method 2
the half-cut trenches and the grooves are formed by laser
Implementation Method 3
the metal overlay in the half-cut trenches and the grooves contact with and conduct with the earth wire
Data Source
AI summary
Disclosed is a shielding process for SIP packaging, including: providing a circuit board; cutting the covering layer to form half-cut trenches separating different SIP packaging modules from each other, and to form grooves in each single SIP packaging module; forming a metal overlay, the metal overlay on an outer surface of the SIP packaging module and at positions where the half-cut trenches are located constituting a conformal shielding, the metal overlay at positions where the grooves are located constituting a compartment shielding; and cutting the half-cut trenches to obtain a plurality of SIP packaging modules that are separate from each other.