SiP Side-Face Opaque Barriers Against Lateral Laser Attacks

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Solution Overview

Problem

Electronic systems in packages (SiPs) are vulnerable to laser attacks through their side faces, as existing protection solutions are not adapted to protect these faces effectively, particularly against lateral laser fault injection (LLFI) attacks, and do not account for various types of SiP systems.

Innovation Solution

Incorporating side protection elements made of opaque materials that form a barrier against laser attacks, which can be electrically conductive and configured to provide electromagnetic shielding, surrounding the chips laterally and disposed within the encapsulation material or separate blocks, to protect against both laser and electromagnetic attacks.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If existing protection solutions (front face diodes, anti-probing layers, electromagnetic shielding) are implemented, then front and rear faces are protected against laser and electromagnetic attacks, but side faces remain vulnerable to laser attacks

Engineering Contradiction:

Improveprotection against laser attacksVSAvoidvulnerability to lateral laser fault injection

Core Design Contradiction:

ReliabilityVSObject-affected harmful factors

Solution Approach 1:

The protection system is segmented by face: front face uses diodes and anti-probing layers, rear face uses electromagnetic shielding, and side faces use opaque barriers. Each segment is optimized for the specific attack vectors it faces, with side protection elements specifically addressing lateral laser attacks that penetrate through the encapsulation material

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

Opaque protection elements are introduced as intermediary structures between the external environment and the sensitive circuits. These elements absorb or block laser beams before they can reach the chips, preventing lateral laser fault injection attacks while being integrated within the encapsulation material structure

Inventive Principle:

Principle #24Intermediary (Mediator)

2Object-affected harmful factors

If opaque protection elements are added to block laser attacks through side faces, then laser protection is improved, but device complexity and manufacturing difficulty increase

Engineering Contradiction:

Improvelaser beam penetration through side facesVSAvoidstructure complexity

Core Design Contradiction:

Object-affected harmful factorsVSDevice complexity

Solution Approach 1:

The opaque protection elements are merged with the encapsulation material structure. The protection elements are disposed within the encapsulation material itself, combining the protective function with the existing structural component rather than adding separate external structures

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The encapsulation material serves multiple functions: it provides mechanical support, electrical insulation, and now also incorporates opaque protection elements for laser blocking. This multi-functionality reduces the need for additional separate components and simplifies the overall device structure

Inventive Principle:

Principle #6Universality (Multi-functionality)

3Object-affected harmful factors

If side protection elements are integrated within the encapsulation material, then protection effectiveness is improved, but manufacturing precision requirements increase

Engineering Contradiction:

Improvelateral laser attack protectionVSAvoidpositioning precision of protection elements

Core Design Contradiction:

Object-affected harmful factorsVSManufacturing precision

Solution Approach 1:

The opaque protection elements are formed within the encapsulation material during the encapsulation process itself, before final assembly. This preliminary integration ensures proper positioning and reduces the need for post-assembly adjustments, lowering manufacturing precision requirements for subsequent steps

Inventive Principle:

Principle #10Preliminary action

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution effectively prevents laser attacks and electromagnetic interference by creating an opaque barrier that blocks laser beams and shields against electromagnetic waves, enhancing the overall security of the electronic system in package across all faces.

Implementation Method 1

several side protection elements comprising at least one opaque material, laterally surrounding the chip(s) and configured to form a barrier at least against laser attacks

Methodology Applied

Scientific EffectAbsorption (EM radiation): Absorption (EM radiation)

Implementation Method 2

which can be electrically conductive and configured to provide electromagnetic shielding

Methodology Applied

Scientific EffectElectromagnetic shielding: Faraday Cage

Data Source

PatentUS11894315B2Electronic system in package comprising protected side faces

Publication Date: 2024.02.06 COMMISSARIAT A LENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES

AI summary

An electronic system in package, including at least:a support;one or more chips mechanically and electrically coupled to a front face of the support;an encapsulation material covering the front face of the support and encapsulating the chip(s);several side protection elements, comprising an opaque material and laterally surrounding the chip(s) and configured to form a barrier at least against laser attacks made through side faces of the electronic system in package that are substantially perpendicular to the front face of the support;and wherein the side protection elements are disposed in the encapsulation material or in one or more first blocks of material distinct from the support and disposed in the encapsulation material.