SiPM Cooling Architecture for Low Dark Noise Photon Detection

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Solution Overview

Problem

Silicon Photomultipliers (SiPMs) face high dark noise issues due to thermally excited electrons, which limit their ability to detect low-level light signals and degrade spectroscopic energy resolution, making them unsuitable for applications requiring single-photon detection and large-area single photoelectron detection.

Innovation Solution

A light detection and measurement device comprising a silicon photomultiplier thermally coupled to a thermoelectric cooler and a sealed enclosure with a heat sinking device to remove waste heat, which reduces dark noise by cooling the SiPM to temperatures below −15°C, thereby matching the performance of conventional PMTs in terms of dark current levels.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Object-affected harmful factors

If SiPM operates at room temperature, then device complexity and power consumption are reduced, but dark noise increases significantly masking low-level light signals

Engineering Contradiction:
Improvedark noiseVSAvoidoperating temperature
Core Design Contradiction:
Object-affected harmful factorsVSTemperature

Solution Approach 1:

The cooling system is divided into multiple independent components: thermoelectric coolers (TECs), heat sinks, thermal vias in the substrate, and optional cryogenic cooling stages. This segmented approach allows progressive cooling from room temperature to below -15°C, effectively reducing dark noise while maintaining system modularity and ease of implementation

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

Thermoelectric coolers serve as intermediary devices between the SiPM detector and the ambient environment. These TECs actively pump heat away from the SiPM, creating a thermal gradient that lowers the SiPM temperature without requiring direct contact with cryogenic fluids, thus reducing dark noise while preserving electrical isolation

Inventive Principle:
Principle #24Intermediary (Mediator)

2Object-affected harmful factors

If conventional liquid cryogen cooling is used, then dark noise is reduced, but device complexity and ease of operation deteriorate

Engineering Contradiction:
Improvedark noiseVSAvoidease of operation
Core Design Contradiction:
Object-affected harmful factorsVSEase of operation

Solution Approach 1:

The patent replaces complex mechanical cryogenic cooling systems with solid-state thermoelectric coolers. These TECs use electrical current to create heat pumping action, eliminating the need for liquid nitrogen tanks, pumps, and complex thermal management infrastructure, thereby dramatically improving ease of operation while maintaining effective dark noise suppression

Inventive Principle:
Principle #28Mechanics substitution (Replace mechanical system)

Solution Approach 2:

The thermoelectric coolers are electrically controlled and can be integrated with the SiPM readout electronics, allowing the system to self-regulate temperature based on operational requirements. The coolers draw power from the same electrical infrastructure that powers the SiPM, creating a self-contained cooling solution that requires no external cryogenic support

Inventive Principle:
Principle #25Self-service

3Area of stationary object

If SiPM area is increased for large-area detection, then detection coverage is improved, but dark noise increases masking single photoelectron detection

Engineering Contradiction:
Improvedetection areaVSAvoiddark noise
Core Design Contradiction:
Area of stationary objectVSObject-affected harmful factors

Solution Approach 1:

The cooling system is designed to uniformly cool entire large-area SiPM detectors by distributing thermal pathways across the substrate. Thermal vias are arranged in patterns that conduct heat from all regions of the SiPM to the heat sinks, ensuring that even large-area detectors maintain low temperatures and suppressed dark noise across their entire active area

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

By changing the temperature parameter of the SiPM from room temperature to below -15°C, the dark noise generation rate is reduced by orders of magnitude. This parameter change enables large-area SiPMs to detect single photoelectrons because the thermal background is suppressed sufficiently across the entire detector area

Inventive Principle:
Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The cooling system significantly reduces dark noise in SiPMs, enabling them to perform as self-contained replacements for vacuum PMTs with improved performance, smaller size, and increased ruggedness, while maintaining reduced power requirements and insensitivity to magnetic fields.

Implementation Method 1

at least one thermoelectric cooler thermally coupled to the silicon photomultiplier

Methodology Applied
Scientific EffectThermoelectric effect: Peltier Effect

Implementation Method 2

heat sinking device thermally coupled to the enclosure configured to remove waste heat

Methodology Applied
Scientific EffectHeat conduction: Conduction (thermal)

Implementation Method 3

heat sinking device comprises a forced-air cooled heat sink

Methodology Applied
Scientific EffectConvection: Convection

Data Source

PatentUS11994427B2Silicon photomultiplier imaging system and method for cooling the same
Publication Date: 2024.05.28 TEMPLE UNIV
  • US11994427B2 patent drawing
  • US11994427B2 patent drawing
  • US11994427B2 patent drawing

AI summary

A light detection and measurement device comprises a silicon photomultiplier, at least one thermoelectric cooler thermally coupled to the silicon photomultiplier, a sealed enclosure surrounding the silicon photomultiplier and the at least one thermoelectric cooler, the enclosure including a substantially transparent window thermally coupled to the silicon photomultiplier, and a heat sinking device thermally coupled to the enclosure configured to remove waste heat. A method of cooling a silicon photomultiplier is also described.