SiPM Light Sensor Assembly with Intermediate Optical Coupling Layer
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Solution Overview
Problem
Current large area photodetector technologies, such as Photomultiplier Tubes (PMTs), face limitations including bulkiness, sensitivity to magnetic environments, high bias voltage requirements, and difficulty in miniaturization, which hinder their application in modern imaging and high-energy physics systems that require compact, magnetic-insensitive, and high-gain detectors.
Innovation Solution
A method of assembling a light sensor module using a Silicon Photomultiplier (SiPM) detector array with an intermediate optically transparent layer for improved optical coupling between SiPM detectors and scintillators or optical sources, enabling efficient light transfer and addressing the challenges of scaling to large areas while maintaining high sensitivity and robustness.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If Photomultiplier Tubes (PMTs) are used for large area detection, then large area coverage and high gain are achieved, but the device becomes bulky and sensitive to magnetic environments
Solution Approach 1:
The patent replaces the vacuum tube-based PMT mechanical system with a solid-state SiPM detector array. This substitution eliminates the bulky vacuum tube structure and its associated magnetic sensitivity, while maintaining large area detection capability through array configuration. The SiPMs are mounted on a printed circuit board substrate, creating a compact solid-state alternative to the traditional PMT assembly.
2Area of stationary object
If Photomultiplier Tubes (PMTs) are used for large area detection, then large area coverage is achieved, but the device structure becomes bulky
Solution Approach 1:
The patent replaces the vacuum tube-based PMT mechanical system with a solid-state SiPM detector array. This substitution eliminates the bulky vacuum tube structure and its associated magnetic sensitivity, while maintaining large area detection capability through array configuration. The SiPMs are mounted on a printed circuit board substrate, creating a compact solid-state alternative to the traditional PMT assembly.
Solution Approach 2:
The patent divides the large area detection function into multiple smaller SiPM detector elements arranged in an array on a printed circuit board. Each SiPM element is a compact solid-state device, and their collective arrangement achieves the required large detection area without the bulk of a single large PMT. This segmentation allows for compact integration while maintaining large effective detection area.
3Ease of manufacture
If direct coupling is used between SiPM detectors and scintillators, then assembly is simplified, but optical coupling efficiency is insufficient
Solution Approach 1:
The patent introduces an intermediate optically transparent layer between the SiPM detector array and the scintillator. This intermediate layer acts as an optical coupling medium that improves light transfer efficiency from the scintillator to the SiPM detectors. The layer is transparent to the relevant optical wavelengths and provides optimal optical matching, enhancing the overall system efficiency while maintaining assembly simplicity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides a compact, high-gain, and magnetic-insensitive large area detection system with improved optical coupling efficiency, enabling better spatial resolution and timing response, suitable for applications like PET scanners and high-energy physics experiments.
Implementation Method 1
the intermediate layer is adapted to provide at least a predetermined level of optical coupling between the optical element and the at least one light sensing element
Implementation Method 2
Avalanche Photodiode (APD) sensors are commonly used to detect extremely small amounts of light across the whole spectrum including UV, visible or IR radiation
Implementation Method 3
a photodiode is biased in avalanche mode, which results in a single incident photon of light producing a large number of electron hole pairs, i.e. a large current
Data Source
AI summary
A method is provided of at least partly assembling a light sensor module having at least one light sensing element optically coupled to a further optical element, for receiving light therefrom. The method comprises coupling the at least one light sensing element to an intermediate layer, wherein the intermediate layer is adapted to provide at least a predetermined level of optical coupling between the optical element and the at least one light sensing element when assembled by subsequently coupling, for example as part of a separate method, the intermediate layer to the optical element, with the intermediate layer being arranged between the optical element and the at least one light sensing element. An optical element other than a light sensing element, for example a light source element, can be used in place of the or each light sensing element, with in that case the or each optical element providing light to the further optical element rather than receiving light therefrom. Thus, the method can relate to an optical assembly in general rather than to a light sensor module assembly in particular.