Substrate Integrated Waveguide Antenna with Slotted Surface
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Solution Overview
Problem
Existing substrate integrated waveguide fed antennas are too thick for compact devices and have high sidelobe levels, making them unsuitable for applications like collision avoidance radar and 5G communications that require low sidelobes and compact form factors.
Innovation Solution
A substrate integrated waveguide fed antenna design featuring a thin electric dipole with a parasitic patch arrangement and a slotted conductive surface, which reduces thickness to less than 0.25λ0 and incorporates a substrate integrated waveguide feed structure to excite the dipole, while also using impedance matching elements and a power divider network to control power distribution and phase for low sidelobe levels.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If a substrate integrated waveguide fed antenna is designed with conventional thickness, then it provides reasonable radiation performance, but the antenna becomes too thick for compact devices
Solution Approach 1:
The patent reduces the substrate thickness parameter to less than 0.25λ0 (where λ0 is the free-space wavelength at the center operating frequency), which is significantly thinner than conventional designs. This parameter change enables compact form factor while maintaining radiation performance through optimized feed structure and parasitic element configuration
2Reliability
If a conventional antenna array is used, then it provides reasonable performance, but it produces high sidelobe levels that are unsuitable for radar and communication applications
Solution Approach 1:
The patent introduces parasitic patch elements as intermediary components that are operably coupled to the fed dipole element. These parasitic elements act as mediators to control the radiation pattern and reduce sidelobe levels without requiring complex array configurations, achieving low sidelobe performance through the interaction between the fed element and parasitic elements
3Length of stationary object
If the antenna thickness is reduced to less than 0.25λ0, then compact form factor is achieved, but impedance bandwidth and radiation stability may be compromised
Solution Approach 1:
The patent segments the antenna structure into multiple functional components: a fed dipole element, multiple parasitic patch elements, and a slotted conductive surface. This segmentation allows each component to contribute specifically to impedance matching and bandwidth enhancement, enabling the thin antenna to achieve adequate impedance bandwidth despite the reduced thickness
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design achieves a thin profile with improved impedance bandwidth and low cross-polarization, suitable for 5G applications, and can be adapted for arrays with stable radiation patterns and reduced sidelobe levels across the desired frequency range.
Implementation Method 1
The substrate integrated waveguide fed antenna includes an electric dipole, a parasitic patch arrangement operably coupled with the electric dipole, and a feed structure. The feed structure includes a substrate integrated waveguide operably coupled with the electric dipole for exciting the electric dipole.
Implementation Method 2
a slotted conductive surface with a slot arranged between (need not be disposed between) the electric dipole and the feed structure for operably coupling the feed structure with the electric dipole
Implementation Method 3
The substrate integrated waveguide fed antenna includes an electric dipole, a parasitic patch arrangement operably coupled with the electric dipole
Data Source
AI summary
A substrate integrated waveguide fed antenna includes an electric dipole arrangement, a parasitic patch arrangement operably coupled with the electric dipole arrangement, and a feed structure. The feed structure includes a substrate integrated waveguide operably coupled with the electric dipole arrangement for exciting the electric dipole arrangement. A slotted conductive surface with a slot is arranged between the electric dipole arrangement and the feed structure for operably coupling the feed structure with the electric dipole arrangement.