SIW Multi-Feed Chip-Package Antenna for Millimeter-Wave Power Combining
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Solution Overview
Problem
Existing chip-package-antenna integrated structures using planar power dividers suffer from poor power amplification performance due to a small quality factor, increased impedance ratio, and limited power capacity as the number of input ports increases.
Innovation Solution
A chip-package-antenna integrated structure based on substrate integrated waveguide (SIW) multi-feed network, where the chip's output terminals are connected to an SIW multi-feed network through an impedance matching network, enabling power combining and directly connecting the SIW output terminal to the antenna, forming a cavity structure with via holes to enhance power capacity and quality factor.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If a planar power divider is used for power combining, then the device complexity is reduced, but the quality factor decreases and power capacity is limited
Solution Approach 1:
The patent transitions from a planar power divider to a substrate integrated waveguide (SIW) structure, fundamentally changing the electromagnetic field distribution and confinement parameters. This parameter change enables higher quality factor and power capacity while maintaining reasonable structural complexity through the planar SIW configuration.
Solution Approach 2:
The patent employs a composite structure combining dielectric substrate material with metallic via holes to form the SIW cavity. This composite approach creates effective electromagnetic confinement with high quality factor while maintaining planar fabrication compatibility, resolving the contradiction between structural simplicity and performance.
2Power
If the number of input ports in the power divider increases, then the power combining capability is improved, but the impedance ratio increases and performance deteriorates
Solution Approach 1:
The patent implements local quality control by designing individual input ports with optimized coupling structures and impedance transformation networks at each port location. This allows each input port to be independently impedance-matched to 50Ω, preventing the impedance ratio problem that occurs in traditional power dividers when scaling the number of input ports.
Solution Approach 2:
The patent introduces intermediate impedance transformation sections and coupling structures between the input ports and the SIW cavity. These intermediary elements serve as impedance matching networks that transform various source impedances to the required 50Ω, maintaining performance even as the number of input ports increases.
3Power
If the power at the output end of the millimeter-wave chip is increased to increase detection distance, then the EIRP is improved, but the system volume and cost increase
Solution Approach 1:
The patent merges the power combining function, impedance matching function, and antenna feeding function into a single integrated SIW multi-feed network structure. This consolidation achieves high EIRP through effective power combining while minimizing system volume by eliminating separate components and interconnections that would otherwise be required.
Solution Approach 2:
The patent implements a nested structure where the SIW cavity is formed by arranging via holes within the dielectric substrate, and the input/output ports are integrated within the same substrate structure. This nesting approach maximizes power combining efficiency while minimizing the overall system volume by placing multiple functions within the same spatial envelope.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration improves the equivalent isotropically radiated power (EIRP) of the system by increasing the quality factor and power capacity of the SIW structure compared to traditional planar power dividers, while maintaining a wider bandwidth and reducing system volume and cost.
Implementation Method 1
The SIW multi-feed network is configured for power combining, and the SIW multi-feed network comprises an output terminal connected to the antenna
Implementation Method 2
substrate integrated waveguide (SIW) multi-feed network
Implementation Method 3
the SIW multi-feed network comprises an output terminal connected to the antenna... in which a plurality of via holes are arranged spaced apart to form a cavity structure
Implementation Method 4
the impedance matching network connects a plurality of output terminals of the chip to a plurality of input terminals of the SIW multi-feed network correspondingly, to achieve an impedance matching between the chip and the SIW multi-feed network
Implementation Method 5
Then the combined millimeter-wave signal is radiated by the antenna
Data Source
AI summary
A chip-package-antenna integrated structure based on an SIW multi-feed network. A plurality of output terminals of the chip are connected to the SIW multi-feed network through the impedance matching network, to achieve the impedance matching between the chip and the SIW multi-feed network. The output terminal of the SIW multi-feed network is directly connected to the antenna terminals, and two or more input signals experience power combining in the substrate integrated waveguide are combined for power combining. Then the combined millimeter-wave signal is radiated by the antenna, finally realizing the power combining in the chip-package-antenna integrated structure. At the same time, the SIW multi-feed network is composed of a SIW structure, in which a plurality of via holes are arranged spaced apart to form a cavity structure.