Semiconductor Package Structure With Six-Sided EMI Shielding
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Solution Overview
Problem
Semiconductor packages often emit electromagnetic interference (EMI) that can interfere with other devices, and existing solutions may not effectively shield against EMI on all sides of the package.
Innovation Solution
A semiconductor package with EMI shielding on all external surfaces, including a method that involves attaching carriers to the encapsulants, forming internal and external EMI shields using suitable materials, and connecting the shields to a ground path for effective EMI reduction.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If EMI shield is added to semiconductor package, then EMI emission is reduced, but device complexity increases
Solution Approach 1:
The EMI shield is integrated within the semiconductor package structure itself, nesting the shielding function inside the existing package. The shield is positioned between the semiconductor die and the encapsulant, utilizing the package's internal space rather than adding external components, thereby reducing overall device complexity while maintaining EMI protection.
Solution Approach 2:
The EMI shield serves multiple functions simultaneously: it provides electromagnetic interference shielding, acts as a structural support element within the package, and can be integrated with the grounding system. This multi-functionality reduces the need for separate components, thereby managing device complexity while achieving EMI reduction.
2Object-affected harmful factors
If EMI shield is added to semiconductor package, then EMI susceptibility is reduced, but manufacturing complexity increases
Solution Approach 1:
The EMI shield is formed as part of the semiconductor package structure during the encapsulation process, before final assembly. By integrating the shield formation into the molding process itself, the manufacturing steps are combined rather than added sequentially, reducing overall manufacturing complexity despite the additional functional requirement.
Solution Approach 2:
The EMI shield formation is merged with the encapsulant molding process. The shield material is deposited or formed within the mold cavity along with the encapsulant material, combining two manufacturing operations into one. This integration reduces the number of separate fabrication steps while achieving both encapsulation and EMI shielding functions.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides comprehensive EMI shielding on all six sides of the semiconductor package, minimizing EMI emission and susceptibility to external EMI, thereby enhancing device performance and security.
Implementation Method 1
A semiconductor package with EMI shielding on all external surfaces... providing comprehensive EMI shielding on all six sides of the semiconductor package, minimizing EMI emission and susceptibility to external EMI
Data Source
AI summary
A semiconductor device with EMI shield and a fabricating method thereof are provided. In one embodiment, the semiconductor device includes EMI shield on all six surfaces of the semiconductor device without the use of a discrete EMI lid.