Semiconductor Package EMI Shield Structure Without a Discrete Lid
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Solution Overview
Problem
Semiconductor packages often emit electromagnetic interference (EMI) that can interfere with other devices, and existing solutions do not effectively shield against both internal and external EMI across all surfaces.
Innovation Solution
A semiconductor package with EMI shielding on all external surfaces and an internal shield between semiconductor devices, along with a method involving carriers and encapsulants to form external and internal EMI shields, ensuring minimal EMI emission and susceptibility.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If EMI shield is added to semiconductor package, then EMI blocking capability is improved, but device complexity increases
Solution Approach 1:
The EMI shield is integrated within the encapsulant structure, nesting the shielding function inside the existing package architecture. The shield is positioned between the semiconductor device and the encapsulant outer surface, creating a nested configuration that provides EMI protection without adding external complexity to the package structure.
Solution Approach 2:
The EMI shield formation process is merged with the encapsulant manufacturing process. The shield is formed as part of the encapsulant structure through a single continuous process sequence, combining what would traditionally be separate shielding and encapsulation steps into one integrated manufacturing flow.
2Object-affected harmful factors
If EMI shield is formed on all external surfaces, then EMI shielding effectiveness is improved, but manufacturing complexity increases
Solution Approach 1:
The EMI shield formation is segmented into distinct process zones corresponding to different encapsulant surfaces. The method separately addresses top, bottom, and side surface shielding through sequential processing steps, allowing each surface to be treated independently while maintaining overall process integration.
Solution Approach 2:
The EMI shield is formed on the encapsulant outer surface before final package completion and testing. This preliminary formation allows the shield to be established as part of the encapsulant structure itself, simplifying subsequent manufacturing steps and ensuring EMI protection is built-in rather than added later.
3Object-generated harmful factors
If internal EMI shield is added between semiconductor devices, then internal EMI interference is reduced, but device complexity increases
Solution Approach 1:
The EMI shield is selectively positioned in specific regions where internal EMI interference is most problematic. The shield configuration is tailored to the local electromagnetic environment between semiconductor devices, providing targeted protection only where needed rather than uniform shielding throughout the entire package.
Solution Approach 2:
The internal EMI shield is nested within the encapsulant structure between semiconductor devices. This nested configuration integrates the shielding function into the existing package architecture without requiring separate external shielding components, thereby reducing overall structural complexity while maintaining effective internal EMI protection.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively blocks EMI from both internal and external sources, reducing interference with other electronic devices and enhancing security by minimizing electromagnetic signal emission.
Implementation Method 1
an electromagnetic interference (EMI) shield on all external surfaces of the semiconductor package, and an internal EMI shield between the one or more semiconductor devices
Data Source
AI summary
A semiconductor device with EMI shield and a fabricating method thereof are provided. In one embodiment, the semiconductor device includes EMI shield on all six surfaces of the semiconductor device without the use of a discrete EMI lid.