Zoned Circuit Board Cooling with Skeletonized Thermal Barriers
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Solution Overview
Problem
Cooling of 'cold' electronic components on a circuit board can inadvertently damage 'non-cold' components due to thermal migration, leading to condensation and potential damage from electrical shorts and corrosion.
Innovation Solution
Implementing a skeletonized configuration on the circuit board with voids and bridges to reduce thermal migration, combined with strategic component placement and temperature regulation using heaters and fans to maintain optimal operating temperatures for both types of components.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If cooling is applied to cold electronic components on the circuit board, then the cold components can operate within their required temperature range, but thermal migration causes non-cold components to be cooled below the dew point leading to condensation and potential damage
Solution Approach 1:
The circuit board is divided into distinct thermal zones: a first region housing cold electronic components requiring low temperatures, and a second region housing non-cold electronic components requiring ambient temperatures. This spatial segmentation allows independent temperature management for each zone, preventing thermal migration from affecting non-cold components while enabling effective cooling of cold components.
2Object-affected harmful factors
If the circuit board structure is modified to reduce thermal migration, then non-cold components are protected from condensation, but the cooling efficiency to cold components may be reduced
Solution Approach 1:
A thermal barrier layer is introduced as an intermediary structure between the first region (cold components) and second region (non-cold components). This barrier layer has low thermal conductivity and selectively blocks thermal migration to non-cold components while allowing the cooling system to effectively maintain the required low temperature in the first region. The barrier acts as a thermal mediator that protects non-cold components without compromising cold component operation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Prevents condensation on non-cold components by reducing thermal migration, allowing both cold and non-cold components to operate within their designated temperature ranges without damage.
Implementation Method 1
a skeletonized configuration in the intermediate zone that reduces thermal energy movement from the outer zone to the inner zone
Implementation Method 2
temperature regulation using heaters and fans
Data Source
AI summary
The discussion relates to thermal management. One example can include a circuit board including inner, intermediate, and outer generally concentric zones and a cryogenically cooled chip located in the inner zone as well as non-cryogenic electronic components positioned in the outer zone. In this example, the intermediate zone can have a skeletonized configuration that slows thermal energy movement from the outer zone to the inner zone.