Localized Skew Compensation Bends for PCB EMI Reduction
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional methods for compensating skew in differential signaling on printed circuit boards often result in increased electromagnetic radiation due to random placement of de-skewing bends, which do not effectively address localized skew caused by routing bends or pin escape offsets, leading to signal integrity issues and phase skew.
Innovation Solution
The implementation of the 'Where bend where compensate' (WBWC) and 'Serial bends single compensation' (SBSC) techniques, which involve strategically placing localized skew compensation bends at turns and near pin-field areas to ensure equal conductor lengths, reducing electromagnetic interference (EMI) and maintaining signal integrity by compensating for skew at specific points along the differential conductor pair.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If conventional random placement of de-skewing bends is used, then skew compensation is achieved, but electromagnetic radiation increases
Solution Approach 1:
The patent applies local quality by placing skew compensation bends only at specific localized positions where skew is generated (at turns and near pin-field areas) rather than using random placement throughout the conductor pair. This targeted approach compensates for skew while minimizing the overall footprint and electromagnetic radiation impact.
Solution Approach 2:
The patent segments the skew compensation function into distinct locations along the differential conductor pair. Instead of a single random bend, multiple compensation bends are strategically placed at different segments (turns and pin-field areas), allowing localized correction of skew without affecting the entire conductor length.
2Manufacturing precision
If conventional random placement of de-skewing bends is used, then skew compensation is attempted, but signal integrity deteriorates due to phase skew
Solution Approach 1:
The patent places compensation bends at specific local positions (turns and pin-field areas) where skew is generated, ensuring that phase alignment is maintained at critical points along the differential pair. This localized approach preserves signal integrity by correcting phase skew where it occurs rather than using random placement that may not address the actual skew locations.
3Object-generated harmful factors
If localized skew compensation bends are placed at turns and pin-field areas, then electromagnetic radiation is reduced, but conductor routing complexity increases
Solution Approach 1:
The patent introduces complexity only where necessary - at specific local positions (turns and pin-field areas) where skew is generated and EMI is problematic. The majority of the conductor routing remains simple and straight, with compensation bends added only at critical locations rather than throughout the entire path.
Solution Approach 2:
The routing complexity is segmented into discrete compensation bends at specific locations rather than distributed throughout the entire conductor path. This allows the majority of the routing to remain simple while addressing EMI and skew issues only where they occur.
Data Source
AI summary
Techniques are provided for electrically connecting components on a printed circuit board (PCB), semiconductor chip package, or other electronic device. More specifically, a first component, configured to generate a differential signal, is disposed on the PCB, while a second component, configured to receive the differential signal from the first component, is also disposed on the PCB. A differential conductor pair comprising first and second parallel conductors extends along a path between the first and second components. The path of the differential conductor pair comprises at least one turn that causes a change in direction of the first and second conductors. The first conductor comprises at least one localized skew compensation bend disposed at the turn such that, at the end of the turn, the first and second conductors have substantially the same length with respect to the first component.