Skin Temperature Estimation for Thermal Mitigation in Computing Devices

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Solution Overview

Problem

Conventional smartphones lack effective thermal mitigation strategies, as they rely on SOC temperature sensors to control skin temperature, which can be a poor proxy, leading to inefficient heat dissipation and potential user discomfort.

Innovation Solution

Implementing a system that estimates device skin temperature by processing temperature data from internal sensors using a low pass filter, amplitude attenuation, and delay, and adjusts processor operating parameters accordingly to maintain safe skin temperatures.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of operation

If SOC temperature is used as a proxy for device skin temperature, then temperature control can be implemented, but the temperature measurement precision is poor leading to inefficient heat dissipation

Engineering Contradiction:
Improvetemperature control implementationVSAvoidskin temperature measurement accuracy
Core Design Contradiction:
Ease of operationVSMeasurement precision

Solution Approach 1:

The patent introduces an intermediary estimation model that translates internal SOC temperature readings into predicted skin temperature values. This model acts as a mediator between the easily measurable SOC temperature and the difficult-to-measure skin temperature, allowing indirect but accurate monitoring of skin temperature without direct contact sensors.

Inventive Principle:
Principle #24Intermediary (Mediator)

Solution Approach 2:

The system performs preliminary temperature estimation and prediction before actual skin temperature thresholds are reached. By using the estimation model to predict future skin temperature based on current SOC temperature trends, the system can take preventive cooling actions in advance, improving measurement precision proactively rather than reactively.

Inventive Principle:
Principle #10Preliminary action

2Object-affected harmful factors

If processor performance is reduced to lower skin temperature, then user comfort is improved, but productivity decreases

Engineering Contradiction:
Improveuser discomfort from heatVSAvoidprocessor performance
Core Design Contradiction:
Object-affected harmful factorsVSProductivity

Solution Approach 1:

The patent implements a closed-loop feedback system that continuously monitors estimated skin temperature and dynamically adjusts processor performance accordingly. The feedback mechanism allows the system to maintain processor at high performance levels when skin temperature is safe, and only reduce performance when necessary, optimizing the balance between user comfort and productivity.

Inventive Principle:
Principle #23Feedback

Solution Approach 2:

The system dynamically adjusts processor performance based on real-time estimated skin temperature conditions rather than using static performance limits. This dynamic approach allows the processor to operate at optimal performance levels whenever thermal conditions permit, reducing unnecessary performance throttling and maintaining productivity while ensuring user comfort.

Inventive Principle:
Principle #15Dynamics

3Device complexity

If conventional temperature control algorithms are used, then simple implementation is achieved, but thermal mitigation effectiveness is poor

Engineering Contradiction:
Improvealgorithm implementation simplicityVSAvoidthermal mitigation effectiveness
Core Design Contradiction:
Device complexityVSReliability

Solution Approach 1:

The patent transforms the temperature control approach by changing the fundamental parameter from direct SOC temperature monitoring to estimated skin temperature monitoring. This parameter change enables more reliable thermal mitigation because it directly targets the actual metric that matters for user comfort, while the estimation model keeps the implementation complexity manageable.

Inventive Principle:
Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach allows for accurate thermal management, reducing processor performance when skin temperatures approach unsafe levels, thereby enhancing user comfort and conserving battery power while ensuring efficient heat dissipation.

Implementation Method 1

receiving a signal from a temperature sensor, wherein the temperature sensor is disposed within the device having a processor chip that produces heat within the device

Methodology Applied
Scientific EffectTemperature sensing:

Implementation Method 2

Processing the temperature data includes applying a low pass filter, an amplitude attenuation, and a delay to the digital temperature data

Methodology Applied
Scientific EffectLow pass filtering: Filter (electronic)

Implementation Method 3

the processor chip produces heat within the device... the heat is spread through the internal portions of the phone to the outside surface of the phone

Methodology Applied
Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentUS10503222B2Circuits and methods providing temperature mitigation for computing devices using estimated skin temperature
Publication Date: 2019.12.10 QUALCOMM INC
  • US10503222B2 patent drawing
  • US10503222B2 patent drawing
  • US10503222B2 patent drawing

AI summary

A method for temperature mitigation includes receiving a signal from a temperature sensor that is disposed within a computing device. A processor chip within the computing device produces heat. The signal from the temperature sensor is converted to temperature data. The method further includes processing the temperature data to generate an estimate of a temperature of an external surface of the device. The processing includes applying a low pass filter to the temperature data, applying an amplitude attenuation to the temperature data, and applying a delay to the temperature data. The method further includes reducing an operating parameter of the processor chip, such as operating frequency, in response to the estimated temperature of the external surface of the device.