Skin Temperature Feedback Control for Processor Power Management
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Solution Overview
Problem
As platform form factors shrink, skin temperature becomes a primary limitation to performance and user experience due to increased heat output, leading to compromised comfort, noise levels, reliability, stability, and performance, as OEMs often overcompensate with aggressive cooling configurations.
Innovation Solution
An apparatus and method for direct and guaranteed platform and skin temperature control, utilizing a power control unit (PCU) with neural network proportional-integral-derivative (PID) controllers and thermal management hardware/software to regulate processor temperature dynamically.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If aggressive cooling configurations are used to maintain skin temperature, then user comfort and reliability are improved, but performance and performance per watt are degraded significantly
Solution Approach 1:
The patent implements a feedback mechanism where skin temperature sensors continuously monitor external surface temperatures and provide real-time data to the power control unit. This feedback loop enables dynamic adjustment of processor power states based on actual thermal conditions, allowing the system to maintain reliability while avoiding unnecessary performance degradation. The feedback-driven approach replaces static aggressive cooling configurations with adaptive thermal management.
Solution Approach 2:
The system transitions from static thermal management configurations to dynamic control by continuously adjusting processor power states (P-states) and performance modes based on real-time skin temperature readings. This dynamic adaptation allows the system to optimize the balance between reliability and performance according to current thermal conditions, rather than maintaining fixed aggressive cooling settings that always degrade performance.
2Productivity
If processor power states are increased to improve performance, then productivity is improved, but skin temperature and user comfort are worsened
Solution Approach 1:
The system employs periodic monitoring of skin temperature at defined intervals and uses this periodic data to adjust processor power states. By implementing periodic thermal checks and corresponding performance adjustments, the system can sustain high performance during acceptable thermal conditions while preventing excessive skin temperature rises, creating a rhythm of performance optimization that respects thermal limits.
Solution Approach 2:
The patent changes the operational parameters of the processor dynamically by adjusting P-states and performance modes based on skin temperature thresholds. When skin temperature remains within acceptable ranges, the system allows higher power states and performance levels. When thresholds are approached, it transitions to lower power states, thereby controlling skin temperature while maximizing performance opportunities.
3Temperature
If cooling systems are enhanced to reduce skin temperature, then user comfort is improved, but noise levels increase due to higher fan speeds
Solution Approach 1:
The system implements self-service thermal management by using onboard skin temperature sensors to autonomously monitor and control processor power states without requiring active cooling intervention. This self-regulating approach allows the system to maintain acceptable skin temperatures through software-controlled power management rather than hardware-based active cooling, thereby eliminating fan noise entirely while keeping users comfortable.
4Ease of operation
If platform form factor is reduced to improve portability, then ease of operation is improved, but heat output density increases leading to thermal management challenges
Solution Approach 1:
The patent applies local quality control by implementing skin temperature monitoring at specific external contact points and adjusting processor power states based on localized thermal conditions. This localized approach allows the compact platform to manage heat output density effectively by focusing thermal management on user-contact areas, enabling portability without sacrificing thermal comfort through precise, location-specific thermal control.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Effectively manages processor temperature to enhance user comfort, reduce noise, improve reliability, and maintain performance by optimizing thermal management without compromising on user experience.
Implementation Method 1
utilizing a power control unit (PCU) with neural network proportional-integral-derivative (PID) controllers
Data Source
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Figure 3(A)
AI summary
An apparatus and method for thermal hardware assist. For example, one embodiment of a processor comprises: a plurality of functional circuit blocks; an interconnect coupled to the plurality of functional circuit blocks; one or more physical or virtual temperature sensors to capture one or more skin temperature measurements; a power management controller to execute a dynamically adjustable thermal control loop to perform an evaluation of the one or more skin temperature measurements based on a corresponding one or more temperature control values and to responsively distribute power to the plurality of functional circuit blocks in accordance with the evaluation, the power management controller to dynamically adjust parameters of the thermal control loop based on measured environmental conditions.