Slant Angle Venting Plate for Electronic Enclosure Cooling
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Solution Overview
Problem
Current electronic devices with vertical venting patterns face restricted airflow due to small openings required for electromagnetic interference (EMI) shielding, which hampers heat removal from electronic components.
Innovation Solution
A slant angle venting pattern is introduced, increasing the surface area for airflow by forming venting perforations, such as hexagonal holes, on a slant angle venting plate that extends at an angle from the vertical sidewall, while maintaining small openings for adequate EMI shielding.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If small openings are used in the venting pattern, then EMI shielding is improved, but airflow is restricted and heat removal is reduced
Solution Approach 1:
The venting pattern is transitioned from a vertical plane to a slanted three-dimensional surface. By changing the orientation from vertical to slanted, the available surface area for venting is increased without changing the opening size, thus maintaining EMI shielding while improving airflow capacity.
Solution Approach 2:
The angle of the venting pattern is changed from vertical (90 degrees) to a slanted angle. This parameter change increases the projected area of the venting pattern, allowing more airflow path while maintaining the same opening dimensions for EMI shielding.
2Ease of manufacture
If the venting pattern is made vertical, then manufacturing is simple, but airflow surface area is limited
Solution Approach 1:
The design moves from a two-dimensional vertical plane to a three-dimensional slanted surface. This dimensional change increases the effective area for airflow while the slanted plate can still be manufactured using standard fabrication processes.
Data Source
AI summary
An electronic device includes a chassis base and a chassis cover which define an electronic enclosure. The chassis base includes a slant angle venting plate extending at an angle from a chassis base sidewall of the chassis base. The slant angle venting plate has a slant angle vent plate pattern formed therein. Further, the chassis cover includes a chassis cover venting pattern covering the slant angle vent plate pattern. As the slant angle venting plate is slanted, the available surface area in which to form the slant angle vent plate pattern is maximized thus maximizing air flow through the electronic enclosure.