Slant Routing Structure for IC Die Interconnects
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Solution Overview
Problem
The limited spacing gap between integrated circuit (IC) dies in semiconductor packaging restricts the number of routing paths, limiting the size of the interface bus and hindering increased data communication capabilities.
Innovation Solution
A routing structure with slant paths, comprising three straight portions with equal wire width and length, where the second straight portion has a slant angle other than 0° and 90°, allowing for more flexible die placement and increased routing paths within the fixed spacing gap.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If the spacing gap between dies is reduced to increase routing paths, then the number of routing paths increases, but the manufacturing difficulty increases and fabrication becomes more difficult
Solution Approach 1:
The routing paths transition from traditional straight-line connections to three-dimensional slanted paths that utilize the vertical dimension and angular space between dies. By introducing slant angles (non-0° and non-90° angles relative to the first direction), the routing structure exploits additional spatial dimensions within the fixed spacing gap, thereby increasing the number of available routing paths without reducing the physical spacing between dies, thus avoiding increased fabrication difficulty.
2Ease of manufacture
If the spacing gap between dies is increased to facilitate fabrication, then the ease of manufacture improves, but the number of routing paths decreases
Solution Approach 1:
By employing slanted routing paths with specific angle constraints, the design maximizes the utilization of available space within the fixed spacing gap. The slant angles allow routing paths to diverge and converge more efficiently, fitting more paths into the same physical distance without requiring increased spacing, thus maintaining both fabrication ease and high routing path count.
Solution Approach 2:
The routing structure incorporates variable slant angles that can be adjusted based on the specific routing requirements and spacing gap constraints. This dynamic approach allows the routing paths to adapt their geometry to optimize the number of paths that can be accommodated within the fixed spacing, rather than using uniform straight-line connections that waste available spatial flexibility.
3Quantity of substance
If the number of routing paths is increased to enhance interface bus size, then the data communication capability improves, but the routing structure complexity increases
Solution Approach 1:
The routing paths utilize asymmetric slant angles rather than symmetric straight-line connections. By allowing paths to angle at specific non-standard angles relative to the reference direction, the design creates more diverse routing trajectories that can be packed more densely within the spacing gap, increasing the number of paths without proportionally increasing the complexity of the routing structure.
Data Source
AI summary
A routing structure between dies is provided, including a trace layer, disposed on a substrate, wherein a plurality of routing paths is embedded in the trace layer. In addition, a first die and a second die are disposed on the trace layer and connected by the routing paths. A spacing gap between the first die and the second die is along a first direction and interfacing edges of the first die and the second die are extending along a second direction perpendicular to the first direction. Each of the routing paths includes a first straight portion in parallel to connect to the interfacing edges. The first straight portion has a slant angle with respect to the first direction other than 0° and 90°.