Slanted IC Package Stack for Legacy PCB Compatibility
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Solution Overview
Problem
Existing integrated circuit (IC) package assemblies face challenges in achieving high density and compatibility with legacy structures due to dimensional constraints, limiting the ability to fit IC packages perpendicular to the base PCB in certain cages.
Innovation Solution
A slanted stack configuration of IC packages is achieved by laterally soldering each IC package to a base PCB at an optimized angle (between 24.1° and 78.3°), allowing for dense arrangements while accommodating legacy structure dimensions, using support components with tapered surfaces for mechanical stability and electrical connections.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If IC packages are arranged perpendicular to the base PCB to achieve high density, then packaging density is improved, but compatibility with legacy structure dimensions is worsened
Solution Approach 1:
The patent transitions from traditional perpendicular (vertical stacking) arrangement to a slanted arrangement where IC packages are positioned at optimized angles (e.g., 45 degrees) relative to the base PCB. This angular reorientation allows the package assembly to fit within legacy cage structures while maintaining high density through three-dimensional spatial utilization.
2Adaptability or versatility
If IC packages are arranged at slanted angles to fit legacy structures, then compatibility with legacy structures is improved, but mechanical stability is worsened
Solution Approach 1:
The patent employs asymmetric support components with tapered surfaces that match the slanted angle of the IC packages. These support structures provide targeted mechanical reinforcement at the slanted interfaces, ensuring stability while accommodating the non-perpendicular arrangement required for legacy structure compatibility.
3Reliability
If IC packages are arranged perpendicular to the base PCB, then electrical connection efficiency is improved, but vertical space utilization is worsened
Solution Approach 1:
By reorienting IC packages at slanted angles rather than perpendicular positions, the patent distributes the vertical footprint across both vertical and horizontal dimensions. This angular arrangement effectively reduces the projected vertical height while maintaining electrical connection integrity through optimized trace routing and contact pad positioning on the support components.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enables dense IC package arrangements within limited vertical spaces, increasing packaging density and compatibility with legacy structures, while maintaining mechanical stability and efficient electrical connections.
Implementation Method 1
mounted on or partly in a support component, which mechanically supports and electrically connects to the IC chip
Implementation Method 2
each of the IC packages is laterally soldered to said base PCB
Data Source
AI summary
Embodiments of the present invention are directed to an integrated circuit (IC) package assembly. The IC package assembly includes a base printed circuit board (PCB), and a set of IC packages. Each of the IC packages includes at least one IC chip, mounted on or partly in a support component, which mechanically supports and electrically connects to the IC chip. In addition, each of the IC packages is laterally soldered to the base PCB (e.g., a motherboard PCB) and arranged transversally to the base PCB and forms an angle α therewith. As a result, a slanted stack of IC packages is obtained, wherein the IC packages are essentially parallel to each other. Further embodiments are directed to related devices, including the above assembly, and to related fabrication methods.