Slanted Probe Card Transmission Structure for Force Absorption
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Solution Overview
Problem
Conventional vertical probe cards face limitations in design that hinder further improvements in absorbing external forces and providing stroke distance, making them inefficient in certain testing configurations.
Innovation Solution
A probe card device with a transmission structure comprising a supporting layer, metal conductors, and an insulating resilient layer, where the metal conductors are slantingly inserted and the insulating resilient layer absorbs external forces through deformation, allowing for reduced conductor length and enhanced stroke distance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If the conventional vertical probe card uses conductive probes to absorb external force and provide stroke, then the probe card can function, but the structural design is limited and cannot be further improved
Solution Approach 1:
The patent merges the insulating layer with the resilient function by forming the insulating layer on the inner surface of the supporting layer, enabling it to deform and absorb external forces. This combines structural support and force absorption functions into a single integrated component, breaking the conventional design limitation.
Solution Approach 2:
The insulating layer is designed to serve multiple functions: electrical insulation, mechanical support, and force absorption. By enabling the insulating layer to deform resiliently, it takes on the stroke-providing function traditionally handled solely by conductive probes, creating a multi-functional structure.
2Force
If the metal conductors are slantingly inserted into the supporting layer, then the insulating resilient layer can absorb external force through deformation, but the conductor length is reduced
Solution Approach 1:
The metal conductors are inserted slantingly at an angle rather than perpendicularly, utilizing the angular dimension to extend the effective force-absorbing path within the supporting layer. This angular insertion allows the conductors to engage the deforming insulating layer more effectively while maintaining adequate electrical connection length.
Solution Approach 2:
The insulating layer is pre-formed on the inner surface of the supporting layer before the metal conductors are inserted. This preliminary preparation enables the insulating layer to immediately provide resilient deformation capability when external forces are applied, allowing the slanting conductors to effectively utilize this pre-positioned resilient structure.
3Object-affected harmful factors
If the insulating resilient layer absorbs external force through deformation, then device under test is protected from damage, but the conventional probe card structure cannot be improved
Solution Approach 1:
The insulating layer is pre-formed on the inner surface of the supporting layer, creating a cushioning structure in advance. When external forces are applied during testing, this pre-positioned insulating layer immediately deforms to absorb the force, protecting the device under test before damage can occur.
Solution Approach 2:
The insulating layer, which would normally just provide electrical insulation, is transformed into a beneficial force-absorbing element. Its deformation under external force converts what could be a harmful rigid structure into a protective resilient element that absorbs impact and protects both the device under test and the probe card structure.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively replaces part of the conductive probe function, reduces conductor length, and prevents damage to devices under test by using the insulating resilient layer to absorb external forces, thereby improving the probe card's performance and cost-effectiveness.
Implementation Method 1
When the exposed segment of any one of the metal conductors is pressed by an external force along a testing direction that is not parallel to the predetermined direction, the insulating resilient layer is configured to absorb the external force through the embedded segment of the any one of the metal conductors so as to have a deformation that provides a stroke distance
Data Source
AI summary
A probe card device and a transmission structure are provided. The transmission structure includes a supporting layer, a plurality of metal conductors spaced apart from each other and slantingly inserted into the supporting layer, and an insulating resilient layer formed on the supporting layer. Each of the metal conductors includes a positioning segment held in the supporting layer, a connecting segment and an embedded segment respectively extending from two ends of the positioning segment, and an exposed segment extending from the embedded segment. Each of the embedded segments is embedded and fixed in the insulating resilient layer, and each of the exposed segments protrudes from the insulating resilient layer. When any one of the exposed segments is pressed by an external force, the insulating resilient layer is configured to absorb the external force through the corresponding embedded segment so as to have a deformation providing a stroke distance.