Sled Mounted Processing Nodes for High Density Server Cooling
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Solution Overview
Problem
Current information handling systems face challenges in achieving high processor density and efficient cooling within limited rack spaces, leading to inefficiencies and incomplete utilization of computing resources.
Innovation Solution
The introduction of sled-mounted processing nodes with multiple printed circuit boards and localized cooling mechanisms, such as cold plates, allows for increased processing density and efficient heat removal within a single server chassis, enabling concurrent insertion of multiple sleds in a server chassis.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If multiple processing nodes are placed in a single server chassis to increase processing density, then processing density improves, but heat generation increases making cooling difficult
Solution Approach 1:
The server chassis is divided into multiple sled bays, each capable of holding separate processing node sleds. This segmentation allows independent cooling zones for each processing node, enabling high processing density while managing heat generation through localized cooling mechanisms in each bay.
Solution Approach 2:
Each sled bay is designed with localized cooling capabilities and thermal management features specific to the processing nodes in that bay. This allows tailored cooling solutions for different processing densities and heat generation levels in different regions of the server chassis.
2Ease of operation
If processing nodes are made removable and insertable to improve maintenance and flexibility, then ease of operation improves, but system complexity increases
Solution Approach 1:
Processing nodes are segmented into removable sleds that can be independently inserted and removed from the server chassis. Each sled is a self-contained module with standardized interfaces, simplifying maintenance while the modular architecture manages complexity through standardization.
Solution Approach 2:
The sled design provides universal functionality across multiple processing nodes, with standardized mechanical, electrical, and thermal interfaces. This universality allows the same sled design to be used in different positions and configurations, reducing overall system complexity despite increased operational flexibility.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enhances processing density and cooling efficiency per unit server, effectively addressing the limitations of existing systems by allowing for higher processor capacity and improved thermal management.
Implementation Method 1
a cold plate in thermal connection to heat generating electronic components of the PCB to enable localized cooling of the PN sled
Data Source
AI summary
A sled mounted processing node apparatus includes a first processing node sled. A first printed circuit board (PCB) is coupled to the processing node sled. Electronic components, including at least one processor, are coupled to the PCB. The apparatus includes a second processing node sled having a second PCB connected to the second processing node sled and a second set of electronic components, including at least one second processor, coupled to the second PCB. The at least one processor and second processor collectively enables increased processing density within a single server chassis. Each processing node sled is configured to be slideably inserted and removed from a server chassis that accommodates concurrent insertion of multiple processing node sleds in respective sled bays of the server chassis.