Sleeve Interior Spline Broaching for Distortion-Free Interference Fit

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Solution Overview

Problem

Conventional methods for securing a hardened metal sleeve to a softer metal shaft using an interference fit often result in distortion of the sleeve due to inadequate accommodation of chip debris during assembly, which can impact critical exterior tolerances, especially under high torque loads.

Innovation Solution

The metal sleeve incorporates an interior series of successively reduced diameter splined portions with angled frontal cutting edges and multiple axially aligned circumferential grooves to collect and distribute chip debris, reducing distortion and the required axial force for assembly.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Strength

If a hardened metal sleeve is pressed onto a softer metal shaft to create an interference fit, then a secure permanent connection is achieved, but chip debris accumulates causing distortion of the sleeve exterior

Engineering Contradiction:
Improveinterference fit strengthVSAvoidsleeve exterior tolerance
Core Design Contradiction:
StrengthVSManufacturing precision

Solution Approach 1:

The interior surface of the sleeve is segmented into multiple circumferential grooves that divide the chip debris collection function across multiple locations. This segmentation allows chip debris to be distributed and contained in separate zones, preventing accumulation that would cause distortion of the sleeve exterior while maintaining the interference fit strength.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The circumferential grooves act as intermediary structures between the chip debris generation zone (where splines cut the shaft) and the sleeve exterior. These grooves capture and hold chip debris, serving as a mediator that prevents the debris from causing distortion of the sleeve's outer surface.

Inventive Principle:
Principle #24Intermediary (Mediator)

2Ease of manufacture

If conventional single-groove design is used, then chip debris collection is limited to one location, but distortion occurs due to inadequate debris accommodation

Engineering Contradiction:
Improvegroove design simplicityVSAvoidsleeve exterior tolerance
Core Design Contradiction:
Ease of manufactureVSManufacturing precision

Solution Approach 1:

The single groove is segmented into multiple circumferential grooves spaced axially along the sleeve interior. This segmentation increases the total capacity for chip debris accommodation while maintaining relatively simple manufacturing processes for each individual groove.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The solution transitions from a single groove in one location to multiple grooves distributed along the axial dimension. This dimensional expansion allows chip debris to be collected at multiple axial positions, significantly increasing debris accommodation capacity without complicating the basic groove geometry.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

3Strength

If high axial force is applied during assembly to achieve interference fit, then secure connection is achieved, but sleeve distortion increases

Engineering Contradiction:
Improveconnection securityVSAvoidsleeve exterior geometry
Core Design Contradiction:
StrengthVSShape

Solution Approach 1:

The circumferential grooves serve as intermediaries that capture chip debris during the pressing operation. By preventing debris from interfering with the interference fit process, the grooves allow the assembly to proceed with more controlled forces, reducing the risk of sleeve distortion while still achieving secure connection.

Inventive Principle:
Principle #24Intermediary (Mediator)

Solution Approach 2:

The chip debris, which is normally a harmful byproduct of the spline cutting action, is converted into a beneficial element by using it to fill and lock into the circumferential grooves. This debris-filled groove system actually enhances the locking mechanism between sleeve and shaft, securing the connection while the grooves contain the debris to prevent distortion.

Inventive Principle:
Principle #22Blessing in disguise (Convert harm into benefit)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This configuration effectively minimizes sleeve distortion and reduces the axial force needed for installation by distributing chip debris over a greater axial length, ensuring a secure and distortion-free interference fit suitable for high torque applications.

Implementation Method 1

the hardened metal splines of the sleeve are adapted to cut into the softer metal exterior diameter of the shaft to create an interference fit. During actual assembly of the two parts, the splines of the sleeve will generate chip debris as the splines cut into the softer metal exterior of the shaft.

Methodology Applied
Scientific EffectAbrasion: Abrasion

Implementation Method 2

a circumferential groove adapted to receive the chips, as well as to provide at least one cutting-edge for cutting into the shaft

Methodology Applied
Scientific EffectPhysical containment: Physical Containment

Data Source

PatentEP2824343B1Sleeve with interior spline broaching system
Publication Date: 2017.10.11 BORGWARNER INC
  • EP2824343B1 patent drawingFigure 1~2
  • EP2824343B1 patent drawingFigure 3~5

AI summary

A metallic sleeve (20) may be pressed with relatively low axial forces onto a softer metallic shaft (12) to produce a permanent interference fit between the sleeve and the shaft even if subject to high torque loads. For this purpose, the sleeve incorporates a plurality of successively reduced diameter, axially spaced, arrays (52, 54, 56) of splines (50) within its interior, with a series of spaced circumferentially extending grooves (30, 32, 34) situated between the arrays. The arrays of splines define angled frontal cutting edges (60, 62, 64) adapted to cut into the metal shaft for rigid securement of sleeve to shaft. The spaced grooves are adapted to collect chip debris (36, 38, 40) during installation of the sleeve to the shaft, each groove providing a volumetric space to provide for the uniform distribution of chip debris within the interface of sleeve and shaft. The sleeve to shaft securement structure can minimize part distortion, particularly when critical external geometry of the sleeve is to be maintained.