Slide Connector EMI Shielding via Segmented Liner
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Solution Overview
Problem
Control systems face challenges in reliably coupling programmable logic controllers (PLCs) to modules in noisy electrical environments, where electromagnetic interference (EMI) can corrupt data and affect system performance.
Innovation Solution
A slide connector system that electrically couples circuit boards, providing a robust and low-cost interconnecting solution with electromagnetic shielding, using an electrically conductive liner and shield to reduce EMI effects, and offering a low impedance ground connection without a full shield apparatus, with the conductive liner encompassing three sides and the printed wiring boards acting as a shield for the un-shielded side.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If electromagnetic shielding is implemented using traditional full shield apparatus, then electromagnetic interference protection is improved, but device complexity and manufacturing cost increase
Solution Approach 1:
The shield apparatus is segmented into multiple discrete components: a conductive liner (310) that lines the receptacle (300) and a conductive shield (320) that couples to the circuit board (305). This segmentation allows each component to be optimized independently and simplifies manufacturing and assembly compared to a monolithic shield structure.
Solution Approach 2:
The conductive liner (310) is nested within the receptacle (300), and the conductive shield (320) is nested within the liner, creating a layered shielding structure. This nested arrangement provides effective EMI protection while minimizing the overall space required and reducing material usage compared to traditional full shield apparatus.
2Object-affected harmful factors
If traditional connector designs are used, then manufacturing simplicity is maintained, but electromagnetic interference protection is insufficient
Solution Approach 1:
The shield system is divided into separate manufacturable components: the conductive liner (310) can be manufactured and installed independently, and the conductive shield (320) is integrated with the circuit board (305) through standard PCB fabrication processes. This segmentation maintains manufacturing simplicity while providing superior EMI protection compared to traditional unshielded connectors.
Solution Approach 2:
The invention changes the electrical conductivity parameter of the connector components by introducing conductive materials (liner and shield) into previously non-conductive or poorly conductive positions. This parameter change enables EMI protection without fundamentally altering the manufacturing process, as the conductive elements can be integrated using standard electronic component fabrication techniques.
3Object-affected harmful factors
If a full shield apparatus is implemented, then electromagnetic shielding is improved, but manufacturing cost increases
Solution Approach 1:
The nested configuration of the conductive liner (310) within the receptacle (300) and the conductive shield (320) within the liner creates an efficient shielding structure that uses minimal material to achieve effective EMI protection. This reduces material costs compared to full shield apparatus while maintaining protective performance.
Solution Approach 2:
By segmenting the shield into discrete components that can be manufactured using standard electronic fabrication processes, the invention avoids the need for expensive custom-molded or machined full shield assemblies. The conductive elements can be produced using conventional PCB and connector manufacturing techniques, reducing overall manufacturing cost.
4Object-affected harmful factors
If the conductive liner encompasses all sides of the receptacle, then electromagnetic shielding is improved, but manufacturing complexity and cost increase
Solution Approach 1:
The conductive liner (310) is strategically positioned to line the receptacle (300) where EMI protection is most critical, rather than enclosing the entire connector assembly. This localized approach provides effective shielding at the point of greatest vulnerability (the receptacle interface) while avoiding the complexity and cost of complete enclosure.
Solution Approach 2:
The invention implements partial shielding with the conductive liner (310) that lines the receptacle (300) and works in conjunction with the conductive shield (320) on the circuit board, rather than providing excessive full-enclosure shielding. This partial action is sufficient to achieve the required EMI protection level while maintaining manufacturing simplicity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively reduces electromagnetic interference, improves electrical noise immunity, and enhances radio frequency emissions by creating a robust interconnect system that is cost-effective and easy to manufacture, while maintaining high-frequency grounding between printed circuit boards.
Implementation Method 1
providing a robust and low-cost interconnecting solution with electromagnetic shielding, using an electrically conductive liner and shield to reduce EMI effects
Implementation Method 2
offering a low impedance ground connection without a full shield apparatus
Data Source
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AI summary
Certain exemplary embodiments comprise a slide connector (3100) that can be adapted to electrically couple a first circuit board (3400) to a second circuit board (3500). The first circuit board can comprise a first receptacle (3200). The second circuit board can comprise a second receptacle (3300). The slide connector can be adapted to be slideably releaseably coupled to each of the first receptacle and the second receptacle.