Multi-Component Carrier for Slider Bar Grinding and Lapping

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Solution Overview

Problem

The existing methods for manufacturing slider bars for data storage devices require multiple process steps and resetting the wafer stack after each grinding and lapping operation, leading to increased complexity, cost, and time, as well as introducing strain and distortion that affect tolerance control.

Innovation Solution

A multi-component carrier device is used to secure slider bars to both a lapping machine and a grinding/cutting machine, allowing for continuous processing without the need for resetting, thereby reducing strain and distortion and improving tolerance control.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Manufacturing precision

If multiple process steps with resetting are used for grinding and lapping operations, then the manufacturing process can be completed, but the complexity, cost, and time increase

Engineering Contradiction:

Improvetolerance controlVSAvoidprocess complexity

Core Design Contradiction:

Manufacturing precisionVSDevice complexity

Solution Approach 1:

The patent combines multiple process steps (grinding, cutting, and lapping operations) into a single integrated carrier device that remains attached throughout all operations. This eliminates the need for repeated resetting and repositioning of the wafer stack, thereby reducing process complexity while maintaining manufacturing precision through continuous processing.

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The carrier device is designed to serve multiple functions simultaneously: it holds the wafer stack for grinding operations, supports cutting operations, and enables lapping operations, all without requiring detachment or repositioning. This multi-functionality reduces the number of separate devices and process steps needed, lowering overall process complexity.

Inventive Principle:

Principle #6Universality (Multi-functionality)

2Manufacturing precision

If multiple process steps with resetting are used, then grinding and lapping can be performed, but fabrication cost and time increase

Engineering Contradiction:

Improvetolerance controlVSAvoidfabrication time

Core Design Contradiction:

Manufacturing precisionVSLoss of time

Solution Approach 1:

The carrier device enables continuous processing by remaining attached to the wafer stack throughout grinding, cutting, and lapping operations. This eliminates idle time associated with resetting and repositioning between operations, significantly reducing total fabrication time while maintaining precision through uninterrupted processing.

Inventive Principle:

Principle #20Continuity of useful action

Solution Approach 2:

The carrier device is pre-configured with all necessary mounting interfaces and positioning features before processing begins. This preliminary preparation allows all subsequent operations to proceed without interruption for repositioning, reducing fabrication time while ensuring precision through pre-established positioning.

Inventive Principle:

Principle #10Preliminary action

3Productivity

If repeated resetting is performed, then processing can continue, but strain and distortion are introduced affecting tolerance control

Engineering Contradiction:

Improveyield of slidersVSAvoidtolerance control

Core Design Contradiction:

ProductivityVSManufacturing precision

Solution Approach 1:

By combining all grinding, cutting, and lapping operations into a single continuous process on an attached carrier device, the patent eliminates repeated resetting actions that introduce strain and distortion. This preserves tolerance control while maintaining high productivity through continuous processing.

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The carrier device provides mechanical support and strain distribution before processing begins, cushioning the wafer stack against the cumulative strain that would result from repeated resetting. This pre-established support system prevents distortion throughout the entire processing sequence, preserving tolerance control.

Inventive Principle:

Principle #11Beforehand cushioning (Prior cushioning)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach simplifies the manufacturing process, reduces fabrication costs and time, and enhances the yield of sliders that meet desired tolerance requirements by eliminating the need for repeated resetting and minimizing stress on the workpiece.

Implementation Method 1

the one or more slider bars attached to the carrier device are lapped

Methodology Applied

Scientific EffectAbrasion: Abrasion

Implementation Method 2

At least one of a grinding operation or a cutting operation is performed on the one or more slider bars

Methodology Applied

Scientific EffectGrinding: Abrasion

Data Source

PatentUS9987719B2Method and assembly for grinding and/or cutting a slider bar on a lapping carrier

Publication Date: 2018.06.05 SEAGATE TECH LLC

AI summary

One or more slider bars are attached to at least one component of a multi-component carrier device. The multi-component carrier device is attached to a lapping arm of a lapping machine and the one or more slider bars attached to the carrier device are lapped. The at least one component of the multi-component carrier device is attached to a grinding/cutting machine. At least one of a grinding operation or a cutting operation is performed on the one or more slider bars.