Slider-Integrated Shock Detection for Head Stack Assembly

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Solution Overview

Problem

Traditional anti-shock designs in disk drive devices are inadequate for preventing damage from shocks and collisions due to low sensitivity of shock sensors, which are often located far from the slider, failing to meet the high accuracy requirements of slider operation.

Innovation Solution

An anti-shock method employing a head disk interface sensor deposited in the slider, which outputs changing voltage based on temperature changes during shocks, triggering a controller to stop the head stack assembly from operating and loading onto a ramp for protection, with a signal processing system to determine damaged components.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Measurement precision

If a traditional shock sensor mounted in the drive PCB is used, then the device complexity is reduced, but the measurement precision of shock detection is insufficient due to the sensor being located far from the slider

Engineering Contradiction:
Improveshock detection precisionVSAvoidsensor placement complexity
Core Design Contradiction:
Measurement precisionVSDevice complexity

Solution Approach 1:

The head disk interface sensor is nested within the slider structure itself, specifically positioned in the slider body near the air bearing surface. This nesting approach allows the sensor to be located at the precise position where shock detection is most critical (near the disk contact point) without adding external components, thereby improving measurement precision while avoiding increased device complexity

Inventive Principle:
Principle #7Nested doll (Nesting)

Solution Approach 2:

The patent introduces a head disk interface sensor as an intermediary element that directly senses shock at the slider-disk interface. This intermediary sensor provides high-precision shock detection by being positioned exactly where shock occurs, eliminating the need for complex signal transmission from distant sensors while maintaining simple device architecture

Inventive Principle:
Principle #24Intermediary (Mediator)

2Reliability

If a buffer component is added between the disk drive and rack, then the anti-shock capability is improved for big shocks, but the device complexity increases and it cannot prevent slider-disk collision

Engineering Contradiction:
Improveanti-shock capabilityVSAvoidbuffer component
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The patent extracts the shock sensing function from the distant buffer component and relocates it directly to the slider through the head disk interface sensor. This extraction allows shock detection at the precise point of impact without requiring additional buffer components, thereby maintaining anti-shock capability while reducing device complexity and preventing slider-disk collision through early detection

Inventive Principle:
Principle #2Taking out (Extraction)

Solution Approach 2:

The slider itself serves the dual function of both operating component and shock sensing element through the integrated head disk interface sensor. This self-service approach eliminates the need for separate buffer components while providing precise shock detection at the critical interface, improving reliability without increasing device complexity

Inventive Principle:
Principle #25Self-service

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach provides high-accuracy control to prevent damage by utilizing a sensitive head disk interface sensor to detect shocks and trigger protective measures, ensuring the head stack assembly operates safely and avoiding collisions with the disk.

Implementation Method 1

obtaining a changing voltage of the head disk interface sensor, which is changed with the temperature of the head disk interface sensor as the slider is shocked

Methodology Applied
Scientific EffectTemperature change detection: Thermal Expansion

Data Source

PatentUS8531797B2Anti-shock method for head stack assembly
Publication Date: 2013.09.10 SAE MAGNETICS (HK) LTD
  • US8531797B2 patent drawing
  • US8531797B2 patent drawing
  • US8531797B2 patent drawing

AI summary

The present invention directs an anti-shock method for head stack assembly which carries a slider for flying on a disk for operation, and the anti-shock method includes: inputting a constant current to a head disk interface sensor which is deposited in the slider; obtaining a changing voltage of the head disk interface sensor, which is changed with the temperature of the head disk interface sensor as the slider is shocked; outputting the changing voltage to a controller with a threshold set therein; if the changing voltage is bigger than the threshold for a specified number of times, the controller is triggered to control the head stack assembly to stop operating and load on a ramp beside the disk; while if the changing voltage is small than the threshold for said specified number of times, the controller is not be triggered and the head stack assembly still operates.