Slider Assembly Support Structure for HAMR Laser Alignment
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Solution Overview
Problem
In heat-assisted magnetic recording (HAMR) technology, achieving accurate alignment of the laser Chip-On-Submount Assembly (COSA) with the optical waveguide is crucial for efficient energy transfer, but conventional bonding methods often result in misalignment and potential damage to the laser diode, leading to reduced energy efficiency and laser degradation.
Innovation Solution
The use of a substrate assembly with a support structure and bond material that redistributes during the bonding process, providing stable mounting surfaces and preventing tilting or crashing of the COSA, ensuring precise alignment and proper gap maintenance between the laser diode and waveguide.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If conventional bonding methods are used to bond COSA to slider, then bonding process is simple, but alignment accuracy between laser diode and waveguide deteriorates
Solution Approach 1:
The support structure is pre-formed on the slider substrate before bonding the COSA assembly. This preliminary structure provides predetermined alignment references and mounting surfaces that guide the COSA into precise alignment with the waveguide during the bonding process, eliminating the need for complex post-bonding alignment adjustments.
Solution Approach 2:
The support structure acts as an intermediary element between the slider substrate and the COSA assembly. It provides alignment references and mounting surfaces that mediate the bonding process, ensuring accurate positioning of the laser diode relative to the waveguide without requiring direct complex alignment between the COSA and slider.
2Reliability
If gap is maintained between laser diode and slider during bonding, then energy efficiency improves, but laser diode may crash into slider or COSA may tilt
Solution Approach 1:
The support structure is designed with features that preemptively prevent crashing or tilting of the COSA during bonding. Alignment references and mounting surfaces are pre-configured to maintain proper spacing between the laser diode and slider while providing mechanical constraints that prevent unintended contact or tilting movements during the bonding process.
Solution Approach 2:
The support structure serves as an intermediary that maintains the necessary gap between the laser diode and slider while preventing harmful contact. It provides mechanical support and alignment constraints that mediate the bonding process, ensuring the gap is maintained without risking COSA crashing or tilting.
3Use of energy by moving object
If alignment accuracy is improved, then energy coupling efficiency improves, but bonding process complexity increases
Solution Approach 1:
Alignment references and mounting surfaces are pre-formed on the slider substrate before the bonding process. This preliminary preparation enables accurate alignment to be achieved during bonding without requiring complex alignment mechanisms or procedures, thus improving energy coupling efficiency while keeping the bonding process relatively simple.
Solution Approach 2:
The support structure acts as an intermediary that translates simple bonding operations into precise alignment outcomes. By providing pre-formed alignment references and mounting surfaces, it enables accurate energy coupling without requiring the bonding process itself to be complex.
Data Source
AI summary
A substrate assembly includes a chip coupled with a carrier, a substrate having a first surface and an opposing second surface, and a support structure mounted to the second surface of the substrate and in contact with the carrier. A method of bonding a chip and carrier assembly to a substrate includes contacting the chip and carrier assembly with the bond material and applying heat and force on the chip and carrier assembly until the support structure is mounted on the second surface of the substrate and in contact with the carrier. A substrate assembly includes a chip coupled with a carrier, a substrate having a first surface and an opposing second surface, and one of the carrier or the substrate comprising a trench having a periphery, wherein the second surface of the substrate supports the carrier along the periphery of the trench.