Slider Trailing Edge Top Bond Pad Interconnect
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Solution Overview
Problem
The increasing complexity of recording head features in data storage devices requires more electrical interconnects, which traditional methods struggle to support efficiently, especially in forming reliable connections between sliders and suspension flex circuits.
Innovation Solution
The implementation of a slider body with bond pads on its trailing edge, aligned with suspension bond pads on a flex circuit, using a conductive material like solder to form a thermal interconnect (TIC) by reflowing solder bumps between the slider and suspension bond pads, ensuring secure and high-density electrical interconnects.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If traditional interconnect methods are used, then manufacturing simplicity is maintained, but the ability to support high-density electrical interconnects and added recording head features is insufficient
Solution Approach 1:
The patent transitions from traditional side-attached bond pads to top-surface bond pads positioned at the trailing edge of the slider. This dimensional repositioning allows bond pads to be located on the top surface rather than the side, enabling better alignment with suspension flex circuit bond pads and supporting higher density interconnects while maintaining manufacturing feasibility through standard soldering processes
2Adaptability or versatility
If more electrical interconnects are added to support increased recording head features, then adaptability improves, but manufacturing difficulty increases
Solution Approach 1:
The bond pads are pre-positioned on the top surface of the slider during slider fabrication, before assembly with the suspension flex circuit. This preliminary positioning ensures precise alignment and allows standard soldering processes to be used, simplifying the overall manufacturing process despite the increased number of interconnects required for advanced recording head features
3Reliability
If bond pads are positioned on the trailing edge top surface, then alignment with suspension bond pads and interconnect reliability improve, but manufacturing precision requirements increase
Solution Approach 1:
The bond pads are specifically positioned at the trailing edge of the slider top surface, a location that provides optimal alignment with the suspension flex circuit bond pads. This localized positioning strategy concentrates precision requirements to a specific area where the mechanical and electrical alignment benefits are maximized, while the rest of the slider can be manufactured with standard tolerances
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method enables the formation of reliable, high-density electrical interconnects that support the added features of recording heads, enhancing the connectivity between the slider and suspension flex circuit, thereby improving the data storage device's performance and efficiency.
Implementation Method 1
using a conductive material like solder to form a thermal interconnect (TIC) by reflowing solder bumps between the slider and suspension bond pads
Data Source
AI summary
An apparatus includes a slider body with a first portion formed of a first insulating material and a second portion formed of a second insulating material that is different from the first insulating material. The second portion of the slider body is at a trailing edge of the slider body and the second portion includes a bearing surface and a top surface opposite the bearing surface. A plurality of bond pads are disposed on the top surface of the second portion such that an entire bottom surface of each of the plurality bond pads is attached to the top surface of the second portion.