Sliding Buffer Module for High-Speed Server Insertion

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Solution Overview

Problem

The excessive speed at which a server module is inserted into a chassis can cause damage to the connectors due to high-speed collisions.

Innovation Solution

A buffer module with a sliding assembly that includes a sliding component, counterweight component, and elastic component, which generates displacement to suppress the movement of the driven component, thereby decelerating or halting the electronic assembly and preventing connector damage.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If the electronic assembly is inserted into the device body at high speed, then the plugging operation is completed quickly, but the connector may collide and get damaged

Engineering Contradiction:
Improveplugging speedVSAvoidconnector damage
Core Design Contradiction:
ProductivityVSObject-affected harmful factors

Solution Approach 1:

The buffer module is pre-installed on the electronic assembly before insertion. When excessive insertion force is applied, the sliding assembly slides relative to the main body, causing the buffer portion to contact the driven component and generate buffering force in advance, preventing connector damage before it occurs.

Inventive Principle:
Principle #11Beforehand cushioning (Prior cushioning)

Solution Approach 2:

The buffer module acts as an intermediary component between the electronic assembly and the device body connector. The sliding assembly and buffer portion serve as mediator elements that absorb excessive insertion force through relative sliding and buffering contact, protecting the connector from direct high-speed collision.

Inventive Principle:
Principle #24Intermediary (Mediator)

2Object-affected harmful factors

If the sliding assembly is designed to suppress driven component movement, then connector protection is improved, but the device structure becomes more complex

Engineering Contradiction:
Improveconnector protectionVSAvoidbuffer module structure
Core Design Contradiction:
Object-affected harmful factorsVSDevice complexity

Solution Approach 1:

The buffer module is segmented into distinct functional components: a main body, a sliding assembly with sliding component, a driven component (gear), and a buffer portion. This segmentation allows each component to perform its specific function independently while maintaining overall simplicity - the sliding component handles the buffering action, the gear provides mechanical advantage, and the buffer portion provides the protective contact.

Inventive Principle:
Principle #1Segmentation

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The buffer module effectively mitigates the motion of the electronic assembly, preventing connector damage by decelerating or stopping the assembly when inserted with excessive force, ensuring a safe and controlled plugging process.

Implementation Method 1

the sliding assembly further includes an elastic component, and the elastic component is connected between the counterweight component and the main body

Methodology Applied
Scientific EffectElasticity: Elasticity

Implementation Method 2

the sliding assembly includes a sliding component and a counterweight component

Methodology Applied
Scientific EffectInertia: Inertia

Data Source

PatentUS20250271915A1Buffer module and electronic device
Publication Date: 2025.08.28 WISTRON CORP
  • US20250271915A1 patent drawing
  • US20250271915A1 patent drawing
  • US20250271915A1 patent drawing

AI summary

A buffer module including a main body, a driven component, and a sliding assembly is provided. The driven component is movably disposed on the main body and is used to move relatively to the main body. The sliding assembly is slidably disposed on the main body along a moving direction, where the sliding assembly is used to contact the driven component to suppress the movement of the driven component. In addition, an electronic device including the buffer module is also provided.