Sliding Circuit Unit Cooling Ducts for Printing Apparatus
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Solution Overview
Problem
Existing printing apparatuses face challenges in effectively protecting circuit boards from mist generated during liquid ejection, which can lead to adhesion and potential damage.
Innovation Solution
A printing apparatus design featuring a sliding mechanism with interconnected ducts that form a third duct to communicate airflow inlets, reducing mist inflow and attachment on circuit boards, and incorporating a cushioning member to prevent mist entry.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If a wall part is provided between the heat sink and the circuit board to reduce mist adhesion, then mist protection is improved, but device complexity increases
Solution Approach 1:
The patent introduces a cover as an intermediary component that houses the circuit board and creates a sealed enclosure. This cover acts as a mediator between the mist-generating environment and the circuit board, preventing direct exposure while maintaining a relatively simple overall structure compared to adding multiple wall parts throughout the apparatus.
2Ease of operation
If the circuit unit is made movable to improve maintenance access, then ease of operation is improved, but reliability may worsen due to potential mist entry during movement
Solution Approach 1:
The patent employs a sliding mechanism that allows the circuit unit to move horizontally along the conveyance direction. The cover maintains its sealed enclosure during this movement, dynamically adapting to different positions while continuously protecting the circuit board from mist. This dynamic design enables maintenance access without compromising protection.
3Temperature
If airflow inlets are provided on both the cover and fixed frame to improve cooling, then heat dissipation is improved, but mist infiltration risk increases
Solution Approach 1:
The patent positions the airflow inlet on the fixed frame at a location that is opposite to the cover's airflow inlet when the circuit unit is at its rearmost position. This creates a localized cooling pathway that bypasses the mist-prone areas. The airflow enters through the fixed frame inlet, flows underneath the circuit unit, and exits through the cover inlet, providing targeted cooling without exposing the circuit board to mist.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively reduces mist inflow and attachment on circuit boards, enhancing protection and reliability by forming a connected airflow path that prevents mist from entering the circuit board's cooling airflow system.
Implementation Method 1
a first airflow inlet (55) formed in a first surface (54) of the cover (52), and a first duct (90) which is formed in the first surface (54) and in communication with the first airflow inlet (55)... a second airflow inlet (82) formed in the fixed frame (80), and a second duct (100) which is formed in the fixed frame (80) and in communication with the second airflow inlet (82)
Data Source
AI summary
A circuit unit includes a circuit board, a cover being configured to house the circuit board inside, a first airflow inlet formed in a first surface of the cover, and a first duct formed in the first surface wherein the first duct is in communication with the first airflow inlet, and a sliding mechanism that supports the circuit unit such that the circuit unit is movable, the sliding mechanism includes a fixed frame, a second airflow inlet formed in the fixed frame, and a second duct that is formed in the fixed frame and in communication with the second airflow inlet, and, when the circuit unit is located at the first position, the first duct and the second duct are engaged with each other such that a third duct is formed to cause the first airflow inlet and the second airflow inlet communicate each other.