Sliding Coupler for Tool-Free Thermal Component Attachment
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Solution Overview
Problem
Conventional heat exchange systems for integrated circuits are cumbersome due to the use of screws for attaching heat exchangers, which increases system profile and complexity.
Innovation Solution
A system featuring a first thermal component for communication with an integrated circuit and a second thermal component with a coupler that can be slidably engaged and disengaged without tools, using sliders and beveled edges for alignment and engagement, potentially with a locking mechanism for secure attachment.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If screws are used to attach thermal components, then reliable attachment is achieved, but system complexity and profile increase
Solution Approach 1:
The attachment system is segmented into modular components: a first thermal component attached to the circuit board, a second thermal component with heat dissipater, and a separate coupler mechanism. This segmentation allows each component to be optimized independently and simplifies the overall attachment process by eliminating the need for multiple screws.
Solution Approach 2:
The coupler is extracted as a separate, removable component from the thermal assembly. This allows the coupler to be independently manipulated for engagement and disengagement without affecting the thermal components, thereby reducing system complexity while maintaining secure attachment when engaged.
2Reliability
If screws are used to attach thermal components, then secure attachment is achieved, but system profile enlarges
Solution Approach 1:
The coupler integrates multiple functions into a single component: it provides alignment features (beveled edges), engagement surfaces, and locking capability all in one piece. This merging eliminates the need for separate alignment elements and fasteners, thereby reducing system profile while maintaining secure attachment.
3Reliability
If conventional screw attachment is used, then thermal component engagement is maintained, but ease of operation deteriorates
Solution Approach 1:
The coupler is designed with dynamic engagement capability, allowing it to be easily inserted and removed by sliding motions. The beveled edges provide automatic alignment during insertion, and the engagement surfaces ensure secure attachment, making the operation simple and tool-free while maintaining reliable engagement.
Solution Approach 2:
The beveled edges on the coupler and corresponding features on the thermal components create a self-aligning mechanism. When the coupler is inserted, the beveled edges automatically guide it into the correct position, eliminating the need for precise manual alignment and simplifying the operation.
4Temperature
If multiple components are used for thermal communication, then thermal function is achieved, but device complexity increases
Solution Approach 1:
The coupler serves multiple functions simultaneously: it acts as a mechanical connector for attachment, provides alignment features through beveled edges, and enables easy engagement/disengagement through its sliding design. This multi-functionality reduces the need for separate components, thereby reducing device complexity while maintaining effective thermal communication.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Facilitates easy engagement and disengagement of thermal components, reducing system complexity and profile, while ensuring reliable thermal communication between the integrated circuit and heat dissipater without the need for screws.
Implementation Method 1
a first thermal component adapted for thermal communication with an integrated circuit and a second thermal component adapted for thermal communication with the first thermal component upon engagement therewith
Data Source
AI summary
A system and method are provided including a first thermal component adapted for thermal communication with an integrated circuit, and a second thermal component adapted for thermal communication with the first thermal component upon engagement therewith. Further provided is a coupler slidably coupled to the first thermal component and/or the second thermal component. In use, such coupler is capable of a first orientation for disengaging, the first thermal component and the second thermal component, and a second orientation for engaging the first thermal component and the second thermal component.


