Sliding Flexible Display Housing Layout for Speaker Leak Control
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Solution Overview
Problem
In deformable slidable electronic devices, such as rollable devices, the arrangement of electronic components within housings that slide with respect to each other is challenging due to assembly tolerances and gaps, leading to performance degradation, particularly for components like speakers that experience sound leaks.
Innovation Solution
An electronic device design featuring a first housing with specific side surfaces, a second housing with a bendable member, and a flexible display, where components are positioned to avoid interference during sliding, using a bendable electrical connection to maintain functionality.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If multiple electronic components are arranged in a three-dimensional stacked configuration, then the integration density is improved, but the manufacturing precision and alignment accuracy become more difficult to maintain
Solution Approach 1:
The patent implements a stacked configuration where multiple electronic component arrangements are vertically nested on top of each other, with each arrangement containing components in specific three-dimensional positions. This nesting approach increases integration density while using through-substrate vias and precise patterning to maintain alignment accuracy across layers.
Solution Approach 2:
The patent transitions from traditional planar two-dimensional component arrangement to a three-dimensional stacked configuration, adding the vertical dimension for component placement. This dimensional change allows higher integration density while employing sophisticated via structures and multi-layer patterning to preserve manufacturing precision in the new spatial configuration.
2Productivity
If the number of manufacturing processes is reduced, then the productivity is improved, but the manufacturing precision deteriorates
Solution Approach 1:
The patent combines multiple manufacturing operations into integrated process steps. Specifically, it merges the formation of through-substrate vias with the patterning of conductive interconnects, and integrates the stacking of multiple component arrangements with the formation of inter-layer connections. This merging reduces the total number of discrete manufacturing processes while maintaining alignment accuracy through synchronized patterning techniques.
Solution Approach 2:
The patent performs preliminary actions by pre-forming through-substrate vias and pre-establishing alignment markers before final component placement. The methodology includes preliminary patterning of conductive interconnects and pre-registration of stacked arrangements, which enables faster subsequent processing while ensuring precise final alignment and connection accuracy.
3Manufacturing precision
If conventional two-dimensional arrangement is used, then the manufacturing precision is maintained, but the integration density is limited
Solution Approach 1:
The patent implements a stacked configuration where multiple electronic component arrangements are vertically nested on top of each other, with each arrangement containing components in specific three-dimensional positions. This nesting approach increases integration density while using through-substrate vias and precise patterning to maintain alignment accuracy across layers.
Solution Approach 2:
The patent transitions from traditional planar two-dimensional component arrangement to a three-dimensional stacked configuration, adding the vertical dimension for component placement. This dimensional change allows higher integration density while employing sophisticated via structures and multi-layer patterning to preserve manufacturing precision in the new spatial configuration.
Data Source
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AI summary
According to various embodiments, an electronic device comprises: a first housing including a first space formed through a first side member which comprises a first side, a second side extending in a direction perpendicular to the first side, and a third side extending from the second side in parallel with the first side; a second housing that is slidably coupled to the first housing along a first direction and includes a second space formed through a second side member; a bendable member that is connected to the first housing, is, in a slide-in state, at least partially accommodated into the second space, and in a slide-out state, forms a side at least partially coplanar with the first housing; a flexible display arranged to be supported through the first housing and the bendable member; at least one electronic component that is disposed in the second space and corresponds to an external environment through a first opening formed in at least a portion of the second side member in the slide-in state; and a bendable electrical connection member that connects the electronic component to the first space, wherein in the slide-in state, at least a portion of the first side and the third side are accommodated in the second space so as not to be seen from the outside, and the at least one electronic component may be disposed at a position not interfered with by the first side and/or the second side in the slide-in state.