Sliding Heat Sink Mounting to Protect GPU Chip Assemblies
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
The existing method of fixing a heat sink on a GPU card causes deformation and excessive stress on the board due to screw fastening, leading to potential chip detachment during impact.
Innovation Solution
A chip apparatus with a heat sink slidably connected to a housing via a guiding assembly, utilizing elastic members and sliding slots to absorb impact forces and reduce stress on the chip assembly.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If the heat sink is fixed to the board using a screw, then the heat sink can be securely mounted, but the board experiences deformation and excessive stress causing the chip to fall off
Solution Approach 1:
The heat sink is changed from a fixed rigid structure to a movable one, capable of sliding along the guiding post when impact force is applied. This dynamic structure allows the heat sink to move away from the chip assembly during impact, reducing stress transmission to the board and chip while maintaining secure mounting during normal operation
Solution Approach 2:
A guiding assembly consisting of a guiding post and elastic member is introduced as an intermediary mechanism between the heat sink and the board. This intermediary structure enables controlled movement of the heat sink while providing guidance and limiting the sliding distance, thereby protecting the chip assembly from impact forces
2Temperature
If the heat sink is made heavy to improve heat dissipation, then cooling performance improves, but impact force increases causing more stress on the board
Solution Approach 1:
The heat sink is designed with movable capability along the guiding post, transforming it from a static heavy structure to a dynamic one. This allows the heat sink to move during impact, reducing the effective impact force transmitted to the board while maintaining the mass necessary for effective heat dissipation during normal operation
3Stability of the object's composition
If the heat sink is rigidly fixed to ensure stability, then mounting stability improves, but stress concentration occurs on the board during impact
Solution Approach 1:
The heat sink mounting structure is changed from rigid fixed to dynamically movable, allowing the heat sink to slide along the guiding post when impact occurs. This maintains mounting stability during normal operation while reducing stress concentration on the board during impact events
Solution Approach 2:
The elastic member in the guiding assembly acts as a pre-configured cushioning element that absorbs and mitigates impact forces before they reach the board. This beforehand cushioning protects the board and chip assembly from excessive stress during impact
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution mitigates impact stress on the chip assembly, improving mechanical performance and reducing the likelihood of chip detachment by allowing the heat sink to slide away from the chip during collisions, enhancing reliability and heat dissipation efficiency.
Implementation Method 1
a heat sink disposed on the other side inside the housing relative to the chip assembly, and the heat sink is thermally connected to the chip assembly
Implementation Method 2
a guiding post fixedly disposed in the housing and an elastic member sleeved on the guiding post. The heat sink is slidably assembled on the guiding post, one end of the elastic member presses against the housing, and the other end of the elastic member presses against the heat sink
Data Source
AI summary
A chip apparatus and an electronic device, where the chip apparatus includes a housing and a chip assembly fastened to one side of inside of the housing. The chip apparatus further includes a heat sink disposed on an opposite side of the inside of the housing, and the heat sink is thermally connected to the chip assembly.