Sliding Immersion Cooling Module for Rack Integration
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Solution Overview
Problem
Conventional immersion cooling systems for high-performance servers are cumbersome and inconvenient due to their large box design, which makes integration into slide rail racks difficult and limits motherboard insertion and removal to a top-bottom direction.
Innovation Solution
An immersion cooling system where the chassis with heat-generating components is slidably integrated into a rack, allowing for easy integration of multiple modules and enabling front-rear sliding, with condensation pipelines positioned above the coolant for efficient heat dissipation and modular design.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a huge box body is used to accommodate multiple motherboards for immersion cooling, then heat dissipation effectiveness is improved, but integration into a slide rail rack becomes difficult and device complexity increases
Solution Approach 1:
The patent divides the immersion cooling system into separate modular units, each capable of accommodating one or more motherboards independently. These modular units can be individually installed or removed from the rack, transforming the monolithic box body into segmented, manageable components that integrate seamlessly with slide rail rack infrastructure while preserving the immersive cooling environment for effective heat dissipation
2Ease of manufacture
If the box body opening faces upwards to accommodate motherboards, then motherboard placement is simplified, but insertion and removal direction is limited to top-bottom which reduces operational convenience
Solution Approach 1:
The patent inverts the traditional upward-opening box design by orienting the modular unit opening to face the front or side, aligned with the rack's insertion direction. This allows motherboards to be inserted and removed in the front-rear direction along the rack, improving operational convenience while maintaining the sealed immersion cooling environment through proper sealing mechanisms at the modular interfaces
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration allows for more convenient operation and maintenance by enabling the immersion cooling module to be easily plugged or unplugged from the rack, facilitating efficient heat dissipation through a two-phase cooling process while allowing for flexible module arrangement and improved operational convenience.
Implementation Method 1
liquid coolant, which absorbs the heat generated by the heat generating elements of the motherboard and vaporizes
Implementation Method 2
vaporizes and condenses on condensation pipelines
Implementation Method 3
absorbs the heat generated by the heat generating elements of the motherboard
Implementation Method 4
Droplets of the liquid coolant on the condensation pipelines fall back into the liquid coolant by gravity
Data Source
AI summary
An immersion cooling system including a rack and at least one immersion cooling module is provided. The immersion cooling module includes a chassis and a condensation pipeline. The chassis is slidably disposed on the rack and is adapted to accommodate a coolant. At least one heat generating component is adapted to be disposed in the chassis to be immersed in the liquid coolant. The condensation pipeline is disposed in the chassis and is located above the liquid coolant. In addition, an electronic apparatus having the immersion cooling system is also provided.