Sliding Interconnect Structure for Flexible Semiconductor Packages
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Solution Overview
Problem
Current semiconductor packages lack the necessary flexibility to maintain electrical connections when bent or warped, which is a challenge for wearable electronic systems and portable devices that require compact, high-data-processing capabilities.
Innovation Solution
A semiconductor package design featuring a first substrate with conductive contact rails and a second substrate with conductive cantilevers or projections that allow for sliding electrical connections, enabling the package to maintain contact and functionality even when warped or bent.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If a conventional rigid interconnect structure is used, then electrical connection stability is maintained, but flexibility and bendability of the semiconductor package deteriorate
Solution Approach 1:
The interconnect structure transitions from a rigid fixed connection to a dynamic sliding connection. The conductive cantilever can slide along the conductive contact rail, allowing the package to bend and flex while maintaining electrical connectivity. This dynamic adaptation resolves the contradiction between flexibility and connection stability.
Solution Approach 2:
The conductive cantilever acts as a flexible conductive element that can deform and slide along the contact rail. This flexible component enables the semiconductor package to be bent without breaking the electrical connection, directly addressing the flexibility requirement while maintaining reliability.
2Volume of moving object
If the package size is reduced for portable devices, then portability is improved, but mechanical strength and resistance to bending deterioration
Solution Approach 1:
The conductive cantilever provides a flexible connection mechanism that can accommodate small package sizes. The sliding design allows the thin flexible package to maintain electrical connections even when bent, enabling compact portable device design without sacrificing mechanical strength.
3Adaptability or versatility
If thin substrates are used to achieve flexibility, then bendability is improved, but structural stability and resistance to breakage deteriorate
Solution Approach 1:
The conductive cantilever is designed as a flexible component that can withstand bending stresses. Its sliding mechanism along the contact rail maintains electrical connection stability even when the thin substrates are bent, resolving the contradiction between bendability and structural stability.
Solution Approach 2:
The sliding mechanism provides a cushioning effect by allowing controlled movement and deformation of the conductive cantilever. This prevents stress concentration that would otherwise cause breakage in thin substrates, maintaining both flexibility and stability.
Data Source
AI summary
A semiconductor package includes a first substrate including a plurality of first connecting portions disposed thereon, a second substrate disposed on a portion of the first substrate to be adjacent to the first connecting portions and including a plurality of conductive contact rails disposed thereon, and a plurality of conductive cantilevers respectively placed in contact with surfaces of the conductive contact rails so that one end portion of each conductive cantilever is electrically coupled to one of the first connecting portions and the other end portion slides along one of the conductive contact rails.