Sliding Part Copper Segregation via Powder Segmentation
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Solution Overview
Problem
The existing sliding parts with iron-based and copper-based raw powders face issues with surface coverage ratio of copper, leading to increased frictional resistance and reduced durability due to gaps between powders, which hinder the segregation of copper at the surface during sintering.
Innovation Solution
A method involving filling iron-based and copper-based raw powders into a forming mold, compacting, and sintering, where the copper-based raw powder has a smaller average diameter and larger aspect ratio than the iron-based powder, allowing copper to segregate on the surface, with a copper-based small-sized powder filling gaps to achieve a high surface coverage ratio of copper.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If copper-based flat raw powder with larger aspect ratio is used to segregate at the surface, then copper segregation is improved, but gaps form between particles reducing surface coverage ratio
Solution Approach 1:
The copper-based raw powder is segmented into two distinct size categories: flat powder for surface segregation and small-sized powder for gap filling. This segmentation allows each particle type to perform its specific function optimally without interfering with the other.
Solution Approach 2:
The small-sized copper-based powder is nested within the gaps formed by the larger flat copper-based powder particles. This nesting arrangement maximizes the surface coverage ratio by utilizing the space between segregated particles.
2Manufacturing precision
If vibration is applied to compact the powder mixture, then copper-based flat powder segregates at the outer side, but iron-based powder emerges creating gaps
Solution Approach 1:
Different regions of the powder mixture are assigned different particle size qualities: larger flat copper particles are positioned at the surface region for segregation, while smaller copper particles are positioned in the interior region to fill gaps and emerge in small amounts at the surface.
3Manufacturing precision
If copper-based flat powder with larger projected area is used, then segregation is enhanced, but gaps between adjacent particles increase
Solution Approach 1:
The solution moves from considering only particle area to considering particle size distribution across multiple dimensions. By introducing a size dimension (large flat particles vs. small particles), the system achieves both segregation and gap filling simultaneously.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach results in a sliding part with significantly reduced frictional resistance and improved durability, as the copper-covered surface enables smooth rotation and maintains strength within the specified copper ratio range of 20-40% by weight.
Implementation Method 1
the copper-based raw powder segregates at the outer side within the filling portion
Implementation Method 2
applying vibration to the mold at the same time for compacting
Implementation Method 3
compact the raw powders to form a powder compact
Implementation Method 4
sintering the powder compact
Data Source
AI summary
There is provided a sliding part in which a surface coverage ratio of copper in the sliding part increases. A bearing which is the sliding part is formed by filling the raw powder into the filling portion of the forming mold, compacting the raw powder to form a powder compact, which is sintered. A copper-based raw powder is composed of a copper-based flat raw powder whose diameter is smaller than that of an iron-based raw powder and an aspect ratio larger than that of the iron-based raw powder, and a copper-based small-sized raw powder whose diameter is smaller than that of the copper-based flat raw powder. The copper is allowed to segregate at the surface of the sliding part. The surface of the bearing is covered with the copper-based small-sized raw powder and the copper-based flat raw powder, thereby the surface coverage ratio of copper can be increased.