Sliding Probe Interface for Denser Performance Board Layouts
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Solution Overview
Problem
The inefficient use of space on semiconductor device performance boards due to the large spacing between probe modules in traditional test devices, leading to insufficient area for electronic component placement.
Innovation Solution
A device interface with slidably mounted probe devices and connecting components that allow for flexible arrangement of probe modules, enabling efficient use of space and compatibility with various test head configurations.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If probe modules are arranged with large spacing on the circuit board, then electrical connection reliability is improved, but the usable area on the performance board for device placement decreases
Solution Approach 1:
The probe module is divided into two separate probe devices that can be independently positioned. The first probe device connects to the performance board while the second probe device connects to the test head. This segmentation allows each probe device to be optimally positioned without requiring large spacing between modules, thereby increasing the usable area on the performance board while maintaining reliable electrical connections through the connecting component.
Solution Approach 2:
A connecting component (cable or flexure PCB) is introduced as an intermediary between the first and second probe devices. This intermediary allows the probe devices to be separated and independently positioned, eliminating the need for large spacing between adjacent probe modules. The connecting component transmits electrical signals while allowing flexible arrangement, thus increasing the usable area for device placement while maintaining electrical connection reliability.
2Manufacturing precision
If probe modules are fixed in position on the test head, then manufacturing precision is improved, but adaptability to different test head configurations decreases
Solution Approach 1:
The probe devices are made movable rather than fixed. The first probe device can be slidably mounted on the first mounting structure and the second probe device on the second mounting structure, allowing them to be repositioned according to different test head configurations. This dynamic positioning capability enables the same device interface to be adapted to various test head types while maintaining precise electrical connections through the connecting component.
Solution Approach 2:
The device interface is designed with universal mounting structures that can accommodate different test head configurations. The first and second mounting structures provide standardized interfaces that work with various probe module arrangements. The connecting component (cable or flexure PCB) provides flexible electrical connection that adapts to different positions, making the device interface universally compatible with different test heads while maintaining manufacturing precision through standardized mounting mechanisms.
Data Source
AI summary
A device interface disposed between a test head and a device under test is disclosed. The device interface includes a first mounting structure, a second mounting structure, and an interconnection structure. The interconnection structure includes a first probe device, a second probe device, and a connecting component which is electrically connected to the first probe device and the second probe device. The first probe device is slidably mounted on the first mounting structure and adapted to be electrically connected to a performance board of the device under test. The second prob is slidably mounted on the second mounting structure and adapted to be electrically connected to a probe module of the test head. The device interface increases a usable area on the performance board of the device under test and improves a flexibility of the performance board usage. A method of testing utilizing the device interface is also provided.