Sliding Coupled Processing Containers for Thermal Expansion Alignment
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Solution Overview
Problem
Existing substrate processing systems face challenges in maintaining consistent processing conditions due to thermal expansion of processing containers, leading to misalignment and potential distortion, which affects film quality and thickness during processes like TiN film formation.
Innovation Solution
The implementation of coupled processing containers with a gap between their side walls, allowing for slidable connection via shafts and recesses, which accommodates thermal expansion and maintains consistent pitch between processing stages, preventing tilting and misalignment.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If processing containers are rigidly connected to maintain structural stability, then structural strength is improved, but thermal expansion causes misalignment and distortion of processing stages
Solution Approach 1:
The connecting part is divided into a fixed portion (attached to one processing container) and a movable portion (attached to the other processing container), allowing differential movement to accommodate thermal expansion while maintaining overall structural stability
Solution Approach 2:
The connecting part is designed with sliding capability along the connection direction, transforming from a rigid static connection to a dynamic connection that can adapt to thermal expansion and contraction of the processing containers
2Device complexity
If processing containers are rigidly connected to reduce device complexity, then connection structure simplicity is improved, but thermal expansion leads to tilting and misalignment
Solution Approach 1:
The connecting part incorporates sliding movement capability in the connection direction, enabling the structure to dynamically adjust to thermal expansion while maintaining simple overall design and stable processing stage alignment
3Measurement precision
If processing containers are fixed together to maintain consistent pitch, then positional stability is improved, but thermal expansion causes distortion and misalignment
Solution Approach 1:
The connecting part is segmented into fixed and movable portions, allowing the system to maintain consistent pitch through the fixed portion while the movable portion compensates for thermal expansion to preserve wafer alignment accuracy
Solution Approach 2:
The connection structure allows for dimensional changes in response to temperature variations, enabling the system to maintain accurate wafer alignment despite thermal expansion by adjusting the relative positions of processing containers
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration stabilizes the processing containers, maintains consistent pitch, and ensures accurate alignment of wafers during film formation, thereby improving film quality and reducing the need for frequent recipe adjustments.
Implementation Method 1
Existing substrate processing systems face challenges in maintaining consistent processing conditions due to thermal expansion of processing containers
Data Source
AI summary
Coupled processing containers include a first processing container and a second processing container provided side by side in a horizontal direction to form a gap therebetween, the first processing container and the second processing container being configured to store substrates, respectively, in order to perform vacuum processing, and a connecting part provided across the gap so as to connect the first processing container and the second processing container to each other, the connecting part being configured to be slidable in the horizontal direction with respect to at least one of the first processing container and the second processing container.