Sliding Server Enclosure with Immersion Cooling
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Solution Overview
Problem
Server racks face overheating issues due to heat generation by components, and existing designs often require additional space for servicing, which reduces density and efficiency.
Innovation Solution
The design incorporates a sliding enclosure configuration with fluid immersion cooling, allowing top access and minimizing unused space by using a cooling distribution unit externally or within each chassis, with hoses and pumps for coolant circulation, and optional external power and communication connections to maintain component functionality during servicing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If traditional server rack designs are used with components mounted in fixed positions, then structural simplicity is maintained, but servicing requires additional space and reduces rack density
Solution Approach 1:
The patent implements sliding enclosures that can move between locked and unlocked positions, allowing dynamic access to components without requiring additional space. The enclosure slides along guides to provide servicing access while maintaining compact rack configuration during normal operation.
Solution Approach 2:
The rack is divided into multiple independent enclosures, each capable of being serviced individually through sliding mechanisms. This segmentation allows localized access without disrupting other components, improving servicing efficiency while maintaining high density.
2Temperature
If cooling space is increased to prevent overheating, then thermal management is improved, but rack density decreases due to additional space requirements
Solution Approach 1:
The patent employs liquid immersion cooling where components are submerged in coolant within sealed enclosures. This hydraulic cooling method provides efficient thermal management in a compact volume, eliminating the need for large air cooling spaces while maintaining high rack density.
Solution Approach 2:
The cooling system changes the thermal parameters by using liquid coolant with high heat capacity instead of air cooling. This parameter change enables more efficient heat removal in a smaller volume, resolving the contradiction between cooling effectiveness and rack density.
3Ease of repair
If enclosures are made removable for servicing, then maintenance ease is improved, but structural complexity and space requirements increase
Solution Approach 1:
The enclosure uses a sliding mechanism with locked and unlocked positions rather than complete removal. This dynamic configuration simplifies the structure compared to fully removable enclosures while maintaining ease of servicing through smooth access.
Solution Approach 2:
The enclosure is extracted from the fixed structure and given mobility through sliding guides. This extraction allows the enclosure to be easily moved for servicing while maintaining a simple integrated structure when in position, reducing overall complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enables efficient cooling of high-density server racks with reduced space requirements, allowing for easier servicing and maintaining component performance without overheating, even when enclosures are partially removed from the rack.
Implementation Method 1
fluid immersion cooling, allowing top access and minimizing unused space by using a cooling distribution unit externally or within each chassis, with hoses and pumps for coolant circulation
Data Source
AI summary
The present disclosure provides a system including a cooling rack for servers, a first enclosure, and a second enclosure. The first enclosure can be coupled to the cooling rack for servers and houses electronics. The second enclosure can be coupled to the cooling rack for servers beneath the first enclosure with a minimal sliding clearance in between the two enclosures. The second enclosure also holds an electronics cartridge and connects to the cooling rack for servers via a slide that enables the second enclosure to slide out from under the first enclosure so that the electronics cartridge can be removed from a top of the enclosure. Further, the second enclosure may contain a fluid to immerse components and absorb heat from the electronics cartridge.