Sliding Stencil Structure for Accurate HPC Package Placement

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Solution Overview

Problem

As high-performance computing (HPC) components become larger, the packaging challenges increase, particularly in achieving accurate and stable placement of conductive structures within semiconductor packages.

Innovation Solution

The method involves using a stencil structure with slidably disposed stencil units and conductive structures, which are aligned and connected with connection materials on a temporary carrier, ensuring precise placement and avoiding displacement issues during the packaging process.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Power

If package size is increased to accommodate HPC components, then computing performance is improved, but placement accuracy and stability of conductive structures deteriorates

Engineering Contradiction:

Improvecomputing performanceVSAvoidplacement accuracy

Core Design Contradiction:

PowerVSManufacturing precision

Solution Approach 1:

The stencil structure is divided into multiple stencil units that can be slidably disposed and independently positioned. Each stencil unit can be precisely placed and secured separately, maintaining high placement accuracy even as the overall package size increases to accommodate larger HPC components

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The conductive structures are pre-formed within the stencil units before the actual packaging process. This preliminary preparation ensures that when the stencil units are positioned and secured on the substrate, the conductive structures are already in their correct configurations, guaranteeing placement accuracy regardless of package size

Inventive Principle:

Principle #10Preliminary action

2Power

If package size is increased for HPC components, then computing capability is enhanced, but stability of conductive structures during processing deteriorates

Engineering Contradiction:

Improvecomputing capabilityVSAvoidstability of conductive structures

Core Design Contradiction:

PowerVSStability of the object's composition

Solution Approach 1:

The stencil units are designed with sliding capability that allows them to be dynamically adjusted during the packaging process. Once positioned, they can be secured to prevent displacement. This dynamic approach ensures stability of conductive structures throughout processing while accommodating larger package sizes for enhanced computing capability

Inventive Principle:

Principle #15Dynamics

Solution Approach 2:

The stencil units serve as intermediary structures that hold and protect the conductive structures during the packaging process. These intermediaries ensure that the conductive structures remain stable and undisturbed until they are permanently integrated into the larger HPC package

Inventive Principle:

Principle #24Intermediary (Mediator)

Data Source

PatentUS20250132169A1Method of fabricating package

Publication Date: 2025.04.24 TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD

AI summary

A method of fabrication a package and a stencil structure are provided. The stencil structure includes a first carrier having a groove and stencil units placed in the groove of the first carrier. At least one of the stencil units is slidably disposed along sidewalls of another stencil unit. Each of the stencil units has openings.