Sliding Stencil Units for Accurate Conductive Structure Placement
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Solution Overview
Problem
As semiconductor packages, particularly those for high-performance computing, face challenges with increasing package size, issues such as overturning and displacement of conductive structures during the packaging process arise, affecting the accuracy and reliability of electrical connections.
Innovation Solution
A stencil structure with slidably disposed stencil units and conductive structures is used, where the conductive structures are introduced into openings on the stencil units, and the temporary carrier and stencil structure are flipped to ensure accurate placement of the conductive structures over connection materials, followed by reflow and encapsulation to secure the connections.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If the package size is increased for high-performance computing applications, then the bandwidth and data rate are improved, but the conductive structures become prone to overturning and displacement during the packaging process
Solution Approach 1:
The stencil units are pre-assembled on a temporary carrier with conductive structures already positioned in their openings before the flipping operation. This preliminary arrangement ensures that when the assembly is flipped, the conductive structures are already in the correct position and orientation, preventing overturning and displacement during the packaging process
Solution Approach 2:
The stencil structure is divided into multiple stencil units that are separately assembled on the temporary carrier. Each stencil unit can be independently positioned and secured, allowing for precise placement of conductive structures without affecting the entire assembly. This segmentation reduces the risk of collective overturning and enables better control over placement accuracy
2Productivity
If the package size is increased for high-performance computing applications, then the data rate is improved, but the conductive structures become prone to overturning during the packaging process
Solution Approach 1:
The conductive structures are pre-positioned within the stencil unit openings and secured on the temporary carrier before the flipping operation. This preliminary securing ensures structural stability is maintained throughout the packaging process, preventing overturning even as package size increases for higher data rates
Solution Approach 2:
The temporary carrier acts as an intermediary support structure that holds the stencil units and conductive structures in place during the packaging process. This intermediary provides the necessary structural stability to prevent overturning, allowing the package to be scaled up for high-performance computing applications
3Productivity
If the package size is increased for high-performance computing applications, then the bandwidth is improved, but displacement of conductive structures occurs during packaging
Solution Approach 1:
The conductive structures are pre-positioned in the stencil unit openings with precise alignment features before assembly. This preliminary precision positioning ensures that when the stencil units are assembled on the temporary carrier and subsequently flipped, the conductive structures maintain their precise placement without displacement, even in larger packages requiring higher bandwidth
Data Source
AI summary
A method of fabrication a package and a stencil structure are provided. The stencil structure includes a first carrier having a groove and stencil units placed in the groove of the first carrier. At least one of the stencil units is slidably disposed along sidewalls of another stencil unit. Each of the stencil units has openings.