Sliding Housing Temperature Sensing for Accurate Thermal Control
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Solution Overview
Problem
Existing temperature calculation methods for electronic devices with variable structures, such as rollable or slidable designs, often result in under- or over-calculating the device's temperature, leading to inappropriate performance control of heat-generating components, which can cause excessive heating or performance reduction.
Innovation Solution
The electronic device employs multiple temperature sensors disposed in movable housings and a processor to selectively use these sensors based on the structure's state, calculating temperature accurately by adjusting weight factors and considering the relative movement of the housings.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If a single temperature sensor is used for temperature calculation in electronic devices with variable structures, then the device complexity is reduced, but the temperature measurement precision deteriorates leading to under- or over-calculating the device temperature
Solution Approach 1:
The electronic device is divided into multiple housing sections (first housing and second housing) with separate temperature sensors in each section. This segmentation allows independent temperature monitoring of different structural regions, enabling accurate temperature calculation that accounts for the variable structure's movement state without requiring an overly complex centralized sensing system.
Solution Approach 2:
The temperature sensing system is made dynamic by selectively using different temperature sensors based on the movement state of the variable structure. The processor determines which housing section is in a reference position and selects the corresponding temperature sensor, allowing the system to adapt to changing structural configurations and maintain measurement precision without increasing overall system complexity.
2Device complexity
If temperature is under-calculated in electronic devices with variable structures, then the device operates with simpler control logic, but the reliability deteriorates due to inappropriate performance control of heat sources
Solution Approach 1:
The system implements feedback by continuously monitoring the movement state of the variable structure and adjusting temperature sensor selection accordingly. The processor receives movement state information, determines the appropriate reference housing section, and selects the corresponding temperature sensor to ensure accurate temperature measurement. This feedback mechanism ensures reliable performance control of heat-generating components without requiring complex control logic.
Solution Approach 2:
The system performs preliminary action by pre-establishing the relationship between housing movement states and appropriate temperature sensors. The processor is configured to determine movement states and select sensors based on predetermined criteria, ensuring that the correct temperature data is available before performance control decisions are made, thereby improving reliability without increasing control complexity.
3Measurement precision
If multiple temperature sensors are selectively used based on movement state, then the temperature measurement precision is improved, but the device complexity increases due to additional sensors and control mechanisms
Solution Approach 1:
The system uses dynamic sensor selection based on the movement state of the variable structure. Instead of deploying multiple sensors simultaneously or using a complex array, the system dynamically selects from available temperature sensors according to which housing section is in the reference position. This dynamic approach maintains measurement precision while avoiding the complexity of permanently activating or managing multiple sensors simultaneously.
Solution Approach 2:
Multiple temperature sensors are designed with universal functionality, where each sensor can serve as the primary measurement point depending on the housing configuration. The sensors are positioned in different housing sections but serve the same fundamental purpose of measuring temperature in the electronic device. This multi-functionality allows the system to maintain precision across different movement states without requiring specialized sensors for each position, thereby reducing overall system complexity.
Data Source
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AI summary
An electronic device according to various embodiments of the disclosure may include a first housing, a second housing configured to be slid into the first housing and slid out from the first housing, a substrate part disposed between the front surface and the rear surface in the first housing and including at least one heat source, a first temperature sensor disposed on the substrate part, a second temperature sensor disposed in the second housing, and at least one processor. The at least one processor is configured to calculate a temperature of the electronic device based on at least one of a measurement value of the first temperature sensor or a measurement value of the second temperature sensor. Various other embodiments may be possible.