Sliding Thermal Module for Compact Heat Dissipation
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Solution Overview
Problem
Existing thermal modules in consumer electronic devices face challenges in achieving high heat dissipation efficiency due to their miniaturized design, which restricts air flow and reduces heat dissipation performance in compact spaces.
Innovation Solution
A thermal module with a sliding mechanism that adjusts its thickness by pivoting a shaft to synchronize the movement of two fan assemblies, allowing for a reduced cross-sectional area in a folded state for miniaturization and an expanded area in an unfolded state to enhance air intake and heat dissipation efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the thermal module is miniaturized to fit compact electronic devices, then the device size is reduced, but the heat dissipation efficiency deteriorates due to restricted air flow
Solution Approach 1:
The thermal module employs a sliding mechanism with two bodies that can relatively move to dynamically adjust the cross-sectional area of the accommodating space. When the first body and second body slide relative to each other, the cross-sectional area changes, thereby adjusting air intake. This dynamic adjustment allows the module to achieve miniaturization when needed while maintaining high heat dissipation efficiency when required, resolving the contradiction between size reduction and heat dissipation performance.
2Volume of moving object
If a smaller volume thermal module is used to meet miniaturization demands, then the device becomes more compact, but the air intake is restricted and heat dissipation efficiency is insufficient
Solution Approach 1:
The sliding mechanism enables dynamic adjustment of the cross-sectional area (air intake area) by moving the first body and second body relative to each other. This allows the thermal module to have a compact volume when in the folded state while being capable of expanding the air intake area when in the unfolded state, thus resolving the contradiction between small volume and sufficient air intake area.
Solution Approach 2:
The invention addresses the area limitation by introducing a third dimension (thickness/depth) through the sliding mechanism. Instead of increasing the air intake area in the planar dimensions, the module extends in the thickness dimension when unfolded, allowing compact storage while providing sufficient air intake area during operation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The module achieves both miniaturization and high heat dissipation efficiency by adjusting its air intake and cross-sectional area, effectively managing heat in compact electronic devices.
Implementation Method 1
the thermal module is configured to exhaust hot air in the machine body and draw cold air in, so as to perform heat dissipation to the processing chip through air convection
Data Source
AI summary
A thermal module including a first body, a second body, a first fan assembly, a second fan assembly, and a shaft is provided. The first body and the second body are slidably connected to each other and form an accommodating space together. The first fan assembly is disposed in the accommodating space and has a first hub and a plurality of first fan blades. The first hub is connected to the first body. The second fan assembly is disposed in the accommodating space and has a second hub and a plurality of second fan blades, and the second hub is connected to the second body. The first hub and the second hub overlap each other. The shaft is pivotally disposed in the first body and the second body and is engaged with the first fan assembly and the second fan assembly.