Slim Bezel Display Module Manufacturing via Peripheral Sealant Filling
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Solution Overview
Problem
The development of display modules is restricted by the need for a reserved width in module packaging, which hinders the achievement of a slim bezel design, especially in portable electronic products that require lightweight, small volume, slimness, and thinness.
Innovation Solution
A manufacturing method involving a module structure with a cover plate, substrate, and front plate, where a holding structure with a sealant is used to fill a defined space, and excess sealant and holding structure components are removed, allowing for accurate and efficient sealing while minimizing bezel width, typically less than 0.3 mm, using techniques like laser cutting to enhance packaging and reliability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a reserved width is used in module packaging, then the packaging is complete and reliable, but the bezel width increases and slimness is compromised
Solution Approach 1:
The patent uses a flexible sealant material that can be applied in a thin film layer (less than 0.3mm) to provide effective sealing between the cover plate and substrate. This thin film approach replaces traditional thick packaging structures, achieving both reliable sealing and slim bezel design.
Solution Approach 2:
The patent extracts the sealing function from the traditional module packaging structure by using a dedicated sealant layer applied only at the peripheral edges where sealing is needed. This separates the sealing requirement from the overall packaging width, allowing the bezel to be minimized while maintaining packaging reliability.
2Reliability
If the sealant is filled into the space defined by cover plate, substrate, and front plate, then sealing effectiveness is improved, but the manufacturing process becomes more complex
Solution Approach 1:
The patent applies the sealant to the peripheral edges of the cover plate or substrate before final assembly. This preliminary application ensures proper sealing positioning and eliminates the need for complex post-assembly sealing processes, reducing manufacturing complexity while maintaining sealing effectiveness.
Solution Approach 2:
The sealant acts as an intermediary material between the cover plate and substrate, filling the peripheral space and providing sealing. This simple intermediary approach avoids complex sealing mechanisms while achieving effective sealing through the inherent properties of the sealant material.
3Length of moving object
If portions of the holding structure and sealant outside the side surfaces are removed, then the bezel width is reduced, but the manufacturing precision requirements increase
Solution Approach 1:
The patent uses laser cutting technology to remove excess holding structure and sealant material. Laser cutting provides high precision and clean edges without mechanical contact, achieving the required manufacturing precision for slim bezel design while efficiently removing material outside the side surfaces.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method effectively achieves a slim bezel design while increasing product reliability and reducing manufacturing costs by accurately filling and curing the sealant within the module, effectively blocking external influences like water vapor.
Implementation Method 1
effectively blocking external influences like water vapor
Data Source
AI summary
A manufacturing method for a display module is provided. The method comprises following steps. A module structure comprising a cover plate, a substrate, and a front plate disposed between the cover plate and the substrate is provided. A space is defined by a lower surface of the cover plate, an upper surface of the substrate, and a side surface of the front plate. A holding structure comprising a holding layer disposed under the module structure is provided. A sealant is filled into the space. Portions of the package layer and the holding structure disposed outside a side surface of the cover plate and a side surface of the substrate are removed.